Electronics Forum | Fri Jul 07 16:52:20 EDT 2017 | tombstonesmt
We had very little success reworking these type of boards. We used a BGA repair station and still was a major hassle. Are these shifted LED's or defective?
Electronics Forum | Wed Jul 04 12:18:14 EDT 2012 | davef
Phil is correct in his description of proper rework technique. Possible explanations of the reason for popping of your BGA are: * Thermal cycling of components cause them to flex on a different point in the cycle that the board possibly resulting in
Electronics Forum | Sun Feb 05 17:44:47 EST 2017 | spoiltforchoice
Printer->Paste Inspection(which might be a feature of the printer)->High speed placer (for all the little parts)->Accurate Placer(for your BGA Processor,RAM,eMMC and big things that don't fit in the high speed)->Reflow oven->AOI->PCB stacker All of t
Electronics Forum | Fri Jan 21 05:18:55 EST 2000 | Dean
If at all possible avoid mirror assembly BGA designs. It has a higher failure rate when compared to non-overlap designs (life testing). In addition, from a rework point of view, X-ray inspection yields no help when a failure occures. You can't det
Electronics Forum | Wed Jul 24 23:21:26 EDT 2002 | ppcbs
Being in the line of BGA rework and having performed much rework on boards that go into military planes, I can give you an opinion from a practical background rather than an in depth study. Basically BGA's have caused many of my customers big headac
Electronics Forum | Fri Jun 30 14:13:23 EDT 2023 | calebcsmt
Is a bridge considered a defect, if adjacent pads/component leads are electrically connected (common) via a trace but said trace is covered in solder mask ? Essentially, of course bridges are never a target but is rework required/de-bridging require
Electronics Forum | Thu Sep 22 10:28:48 EDT 2011 | davef
We agree with you. Recognize that these new solder connections have less metal and a lower standoff than similar BGA solder connections that have not been reworked. This could reduce the reliability of your product, somewhat. Flux or gel may be use
Electronics Forum | Fri Nov 09 20:15:26 EST 2001 | caldon
I concur with Dave.....I have done this often with little fall out. After rework reflow we would x-ray just to ensure an acceptable joint structure. Just for curiosity sakes....are you removing a defective BGA and replacing with a good one? Site pre
Electronics Forum | Tue May 04 11:05:44 EDT 1999 | Dave F
| All - | | I'm looking for some equipment to build proto and small volume assemblies with BGA components on them. I'm thinking about purchasing a rework machine to do the proto and small volume runs and purchase assembly equipment later. | | 1.
Electronics Forum | Tue Mar 20 05:26:32 EDT 2007 | CL
Hi Chrissie, BGA Rework from one CM's view: 10% process problem (printing, reflow, voids, etc) 10% component failure (no other problem found) 80% "The board does not work therefore it must be the BGA" This, of course, is exaggerated. My point bein
