Electronics Forum | Mon Mar 19 00:14:44 EST 2001 | zam_bri
Our process mostly are double sided reflow and we are using water soluble paste on ENTEK PCB. Rework WIP has been accumulated since the last 4 months, and upon clearing, one of the method that the test guy use are to reflow the PCB again for one mo
Electronics Forum | Mon Mar 19 08:56:17 EST 2001 | fmonette
One very important consideration in your situation is to determine if you have moisture sensitive components on these boards. If you have any device classified level 3 or higher then you have a very high level of risk associated with moisture sensit
Electronics Forum | Mon Mar 19 11:26:21 EST 2001 | Steve
Another issue is that once solder paste has been reflowed, the majority of the flux is gone. If it is reflowed again without solder flux, the risk of introducing oxidation to the component leads is increased, thus creating a weak solder joint.
Electronics Forum | Tue Mar 20 18:51:34 EST 2001 | gburson
Another consideration is that heat damage is accumulative. If you have temperature sensitive components, that third reflow may be bringing them close to their failure point.
Electronics Forum | Mon Aug 13 18:16:31 EDT 2001 | fmonette
Be very careful how you perform the removal process if you want to re-use BGA/CSP devices. As you are aware, the majority of these components are classified as moisture-sensitive by the manufacturer. This means that if they absorb too much moisture
Electronics Forum | Fri Apr 16 08:20:58 EDT 2004 | Bob L.
We've seen problems with BGA balls breaking at in-circuit test. I did some bend testing and found that our large BGA's can handle amazing stresses at low strain rates but we get brittle fractures at high strain rates, especially with Ni/Au surface f
Electronics Forum | Mon May 12 16:31:39 EDT 2008 | tsvetan
Hi, there are different BGA packages, it's not same to rework LFBGA with 0.5 mm step and BGA with 1.27 mm step for instance basically you will be able to de-solder the BGA with hot air and proper nozzle which distributes the heat even on the BGA pa
Electronics Forum | Wed Aug 22 03:07:20 EDT 2018 | robl
Doesn't look like it would be deliberately high temp for it's functionality or package type, unless it was accidental on a batch at the packaging plant. To get the datasheet you have to either go through the "request Info" on https://www.kingston.co
Electronics Forum | Thu Jun 06 07:28:30 EDT 2002 | cyber_wolf
It has been my experience that the only thing(s) that will ever cause this is: 1. Operators with paste on their hands. 2. Paste on the screen printer tooling. 3. Paste on the bottom of the stencil. Even very very small amounts of paste on the gold fi
Electronics Forum | Mon Jun 17 19:10:04 EDT 2013 | hegemon
You have not mentioned exactly how the BGA was reflowed onto the board. Was it sent through the oven again after the mini-stencil, or was it heateed up and reflowed using a BGA rework station, or other hot air device?? From the sound of it (outside
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