Electronics Forum: rf modules (Page 1 of 1)

0201's, csp's and mold cap

Electronics Forum | Fri May 14 08:31:07 EDT 2004 | todd_ferrell

We're looking for a contractor who can support high volume production of 0201 passives and 1-2mm csp's to create 4mm sq. RF modules as well as mold cap capabilities. Any leads would appreciated.

new to circuit boards trying to figure out where to connect positive and negative power to wireless transmitter

Electronics Forum | Mon Jan 30 12:35:31 EST 2017 | davef

Look here: http://arduinobasics.blogspot.com/2014/06/433-mhz-rf-module-with-arduino-tutorial.html

Re: MI Solder temp & RF routing

Electronics Forum | Fri May 15 18:26:06 EDT 1998 | Earl Moon

| | Hello. | | 1 Could anyone tell me the range of temperature | | to solder MI components? The process eng is using 400~500 | | degrees Celcius!! For standard 0805/0603 chips & TH components & | | also to touch up on ICs. What

Re: MI Solder temp & RF routing

Electronics Forum | Thu May 14 21:46:27 EDT 1998 | D.Lange

| Hello. | 1 Could anyone tell me the range of temperature | to solder MI components? The process eng is using 400~500 | degrees Celcius!! For standard 0805/0603 chips & TH components & | also to touch up on ICs. What is the con

Re: Double Reflow (Weight/Surface Area) Ratio Rule

Electronics Forum | Tue Mar 24 17:08:52 EST 1998 | Steve Gregory

David, There was a thread going on the IPC TechNet about exactly the same thing... The ratio that was posted is: Less than, or equal to 30-grams per square inch Which means if you weighed a part and it is 30-grams, you'll need .033" of surf

Re: Double Reflow (Weight/Surface Area) Ratio Rule

Electronics Forum | Tue Apr 07 05:41:34 EDT 1998 | Bob Willis

Based on work I have been doing recently the most common reasons for component loss is board flexture and vibration on the reflow process. If parts do not reflow then weight is not an issue. There is a video on double sided reflow and PIHR from the S

Ceramic PCB's

Electronics Forum | Wed Feb 25 08:34:00 EST 1998 | Earl Moon

CERAMIC CIRCUITRY Starting with hybrid thick film circuits in 1965 at Sperry Flight Systems, I have been involved with ceramics (usually aluminum oxide) as the substrate material. Then, we developed "multilayer" circuitry (replacing "cordwood" module

Re: Ceramic PCB's

Electronics Forum | Wed Feb 25 08:30:44 EST 1998 | Earl Moon

| Happy Holidays All, | I am searching out a vendor (US preferred) who can fabricate a ceramic PCb with etremely fine lines. | Please reply if you are a vendor, or know of one. | Thanks, | Wendy CERAMIC CIRCUITRY Starting with hybrid thick film circ

I mounted the parts on the buck-boost DCDC converter and measured the characteristics

Electronics Forum | Tue Aug 23 03:29:37 EDT 2022 | samhe

I received a buck-boost DCDC board with an optical sensor from NextPCB, so I mounted the components and measured the efficiency. Table of contents Board received from NextPCB Solder paste printing Mounting of parts Reflow operation check Attaching

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