Electronics Forum | Sun Apr 25 04:12:34 EDT 1999 | Earl Moon
| At Sanders (Military manufacturer), we have only started using plastic parts within the past few years. After being tasked with reviewing the new J-Std-033, it became obvious to me our process for controlling device exposure is weak. We build very
Electronics Forum | Mon Feb 12 11:12:16 EST 2007 | davef
Q1. After reflow some boards start producing bumps/bubbles which damage the internal layers causeing PCBs failed in Electrical-testing. How can I eradicate this problem from my assembling process? A1. Find a proper board supplier. Q2. If SMT compon
Electronics Forum | Thu Oct 26 12:27:40 EDT 2000 | Dave Cunningham
What guidelines would you suggest for an assembly house concerning the baking of bare PCB's (assume FR4) and flexes/rigid-flexes before assembly.
Electronics Forum | Fri Jan 29 10:03:25 EST 2010 | jamyboy
The SMT MFG Process for Flex circuits is relatively the same as traditional SMT process, the key is your PCB supplier. The good flex circuit shops will supply the circuits in a rigid carrier or if Rigid/Flex the supplier will create a support structu
Electronics Forum | Fri Jul 07 09:15:23 EDT 2000 | K. Chak
Hi Dave, This particular p/n calls for print&etch for wet process..and the problem occured due to surface contamin. with resist residue resisting copper from etching off. The high pressure nozzle was a problem at developing oper. and it is fixed now
Electronics Forum | Sun Feb 11 23:32:43 EST 2007 | M.Haris
1. After reflow some boards start producing bumps/bubbles which damage the internal layers causeing PCBs failed in Electrical-testing. How can I eradicate this problem from my assembling process? 2. If SMT components are mounted on non-rigid FLEX PC
Electronics Forum | Thu Apr 05 08:59:43 EDT 2007 | rgduval
Dave, I've seen some instances of solder as you mentioned "painted" over the joint. Almost looks like a seam between the added solder and the originally waved on solder. Typically, I've seen that in the past from an incomplete solder joint. One w
Electronics Forum | Thu Apr 05 09:18:14 EDT 2007 | pjc
Please note that pin holes and blow holes are not always defects. The latest IPC 610A Rev D workmanship standard has them as process indicators- depending on Class. I don't have the document handly while writing this. It would be good to look that up
Electronics Forum | Wed Apr 04 14:29:16 EDT 2007 | rgduval
Anyone have experience wave soldering rigid flex assemblies? I've just picked up a new job from a customer; it's a rebuild for the company, but new to me. The customer had previously taken their business elsewhere due to delamination problems with
Electronics Forum | Wed Sep 30 10:38:42 EDT 1998 | Earl Moon
| Anyone have ideas how to get MIL 50884 Qualification?. | | We are a small/mid sized Flex, rigid-flex circuit shop in Canada considering MIL Qualification. Is there any web site that we could check out? | | any advice is appreciated. | thank
