Electronics Forum | Mon Oct 28 09:48:10 EST 2002 | gregp
If I understand correctly you want to pick BGAs from the ball side using some type of vacuum arrangement. You will find that the reliability of this is dependant on the size of the balls and the pitch. The larger the balls and tighter the pitch, th
Electronics Forum | Sat Mar 11 08:53:44 EST 2017 | tch
My company is looking for a vacuum that can handle being used to clean up solder splashes on the bottom of our wave solder machines and around the solder pot area in our ERSA Selective Solder Machines. In the past we would use a Shopvac but these don
Electronics Forum | Mon Oct 09 06:16:31 EDT 2017 | jamesbarnhart
I think you needed an IPC Class 3 annular ring because for very dense designs, the smaller the annular ring the better, as less space is taken by the pad or via and more space can be dedicated to routing the traces in highly populated areas of the bo
Electronics Forum | Thu Feb 25 07:37:42 EST 2010 | pcbrown
We are using Humiseal 1B31 and polyester dots for masking. We are spraying this in a Binks sprayer mixed at almost 1:1 with 521 thinner. Whe are seeing the coating creating thin halos around the poly dots as if the dots are "rejecting" the coating. T
Electronics Forum | Thu May 23 13:24:14 EDT 2013 | rgduval
We agree that it looks like a touch-up process. However, we're not certain that it would meet Class 3 requirements. It appears to be an incomplete solder joint. The outer bit of solder shows voiding to the inside bit of the solder joint, and it lo
Electronics Forum | Fri Oct 08 22:09:47 EDT 1999 | KEVIN SIMPSON
| | | | I am loking for second hand panasonic feeders MVII and MPA. | | | | Please tell me characteristics, price and waranties. | | | | | | | | | | | | What are you looking for ? What sizes etc? With the MVII | | you are capable of using a dual r
Electronics Forum | Fri Dec 24 05:12:08 EST 2004 | Patrick Tavernier
Hi ! Thank's for your replies. I'm seeing you're very concerned about this subject. I think RoHS and WEEE arrive too soon. Not technological solution about whiskers and tin pest. RoHS implicates a lot of money for to implemente news process. We must
Electronics Forum | Thu May 01 15:11:37 EDT 2008 | dphilbrick
CK So as I see it batch B represents a leaded process with leaded components and D is a leaded process with lead free components. Batch Components Paste B SnPb Sn62 D Lead-free Sn62 If so it is BETTER to run a lead free BGA with Sn
Electronics Forum | Wed Sep 13 03:25:43 EDT 2017 | sbar5781
Any insight appreciated!
Electronics Forum | Fri Sep 08 21:49:24 EDT 2017 | sbar5781
Hello, I have a few PCB boards i am trying to be manufactured that are miniaturized medical devices. Thus they require IPC Class 3 Specs. However as miniature devices they have limited space, including a 0.4mm pitch BGA socket, which currently has
