Electronics Forum | Sat May 20 03:02:16 EDT 2000 | Dane Stokes
I'm looking for information on anyone who specializes in the rebuilding or refurbishing of Sanyo feeders used on the Universal 4790-4791 model HSP machines. Please E-mail information to dstokes@ra.rockwell.com
Electronics Forum | Fri Nov 05 16:00:22 EST 1999 | Jeff Kennedy
Anyone have information on the ROSA Technique? It is a derivative of the SERA analysis for solder-ability on pads, (they are not italian sisters)I belive the techniques were developed by Rockwell and Motorola. thanks in advance. JKK
Electronics Forum | Sat May 05 08:00:54 EDT 2007 | davef
Continuing with CF's point on mixed alloy processing of BGA, look here: http://www.aciusa.org/leadfree/LFS_SUMMIT-PDF/09_HILLMAN_Rockwell_Collins_BGA.pdf
Electronics Forum | Mon Nov 05 19:43:09 EST 2007 | davef
"Effects of surface finish on high frequency signal loss using various substrate materials" - Call Don Cullen at Mac Dermid or Larry Gatewood at Rockwell Collins for a copy.
Electronics Forum | Mon May 12 15:19:54 EDT 2008 | guyramsey
Did any of you guys read the article from Rockwell Collins? http://www.smtnet.com/library/files/upload/The_impact_of_reflowing_a_pbfree_solder_alloy.pdf
Electronics Forum | Mon Feb 11 20:07:46 EST 2002 | caldon
Stephano- There is a Chemical process to revert the contamination back to its original form. The EMPF Developed it back a few years ago in conjunction with Rockwell and some others. Please contact ACI at 610-362-1200 and ask for Dr. Greg Parks. This
Electronics Forum | Tue Apr 23 07:38:27 EDT 2002 | jeremyt
Hi there. I Have a question that hopfully someone on here can answer for me. On a Universial GDM, is there anyway to get all 4 pumps (pistion style) to purge at the same time. The software only allows for one pump at a time. The reason i am trying to
Electronics Forum | Mon Mar 29 11:48:43 EDT 2010 | davef
SAC BGA In A Sn/Pb Reflow Process Conclusion: Area array components (ball grid arrays, chip scale packages, flip chip packages) with Pbfree solder sphere alloys should not be reflowed using a tin/lead reflow profile due to the resulting non-uniform s
Electronics Forum | Wed Mar 27 21:20:30 EST 2002 | davef
There is two major BGA coating camps. * Camp #1: "We require the coating to be under low stand-off devices but with no filleting. So we apply a thinned dip coat first, and then top-off with a proper spray coat" * Camp #2: "We want no coating under th
Electronics Forum | Wed Apr 05 22:31:51 EDT 2000 | Dave F
Robert: Out of curiosity, by "BT" do you mean: � Bismaleimide triazine, the stuff used to increase the tg of resins used in some BGA interposers. � British Telecommunications plc, the guys with bad teeth. � BrookTree, the RAMDAC supplier, that�s par
