Electronics Forum | Tue Apr 13 18:12:54 EDT 1999 | David
| I am looking for a BGA rework/placement system and would like any experience that you have had. I am looking for a system that is reasonable for the placment, removing and re-balling | | thank you | You might want to look at Advanced Techniques
Electronics Forum | Fri Apr 09 12:46:10 EDT 1999 | Bob Barr
I have been using an Air-Vac DRS-22 for almost two years with very good results. Once a profile is developed it is very repeatable. The DRS-22 is no longer available, however. It has been replaced by the DRS-24. Unfortunately, the DRS-24 has a lo
Electronics Forum | Sat Apr 10 10:01:43 EDT 1999 | Jeff Price
| | I am looking for a BGA rework/placement system and would like any experience that you have had. I am looking for a system that is reasonable for the placment, removing and re-balling | | | | thank you | | | -I have had wonderful results with
Electronics Forum | Tue Jul 14 18:42:41 EDT 2009 | anndi
1smtdude, I interested in your explaination of > re-work an underfill part. You mention the > material can be heated to a plastic state to > become vicious... do you know usually what range > is the temperate? (guess it can depend on the > type
Electronics Forum | Fri Mar 19 10:02:44 EDT 2010 | karlo
There is a wide range of BGA underfills to satisfy specific needs. Some are designed for those who place a premium on high speed, high volume processing, shock or drop test perforamnce, and ease of reworkability. Others are designed for those who p
Electronics Forum | Tue May 19 08:20:10 EDT 2009 | Mity C
Good Morning, We are underfilling some of our BGA's. This is a specified customer requirement. The material we are using is Emerson & Cuming E-1216 (also specified by the customer) The material was selected because of a close CTE match with the PCB.
Electronics Forum | Tue Mar 09 22:06:24 EST 2004 | Ken
Two words that will send shivers down any self-respecting rework professionals spine: HEAT GUN Not affiliated with black and decker or vidal sasoon hair dryers.
Electronics Forum | Tue May 19 06:57:33 EDT 2009 | cunningham
whats the reason for the underfill? we dont underfill any of our BGAs rework could be a issue if they need to be replaced? tried DP190?
Electronics Forum | Wed Jul 01 18:49:27 EDT 2009 | stevenlimth
1smtdude, I interested in your explaination of re-work an underfill part. You mention the material can be heated to a plastic state to become vicious... do you know usually what range is the temperate? (guess it can depend on the type/manufacturer o
Electronics Forum | Fri Mar 19 10:06:22 EDT 2010 | karlo
Rework is typically done by heating the BGA to 170-180C to first scrape off the fillet. Then, heat to above reflow, and lift the BGA. Then, collapse the solder with heat and flux. Then, back down at 170-180C, scrape off the underfill from the boar
