Electronics Forum | Fri May 22 15:37:23 EDT 2009 | 1smtdude
Depending on the material chosen, it's possible to �rework� underfilled components. However, it's far from a production process. Two steps are usually required. First: remove the package from the PCB. Second: remove the residual underfill from the P
Electronics Forum | Wed Jul 15 12:31:20 EDT 2009 | rwyman
Depending on the end use of the PCB, edge or corner bonding may be adequate. Much easier to rework as the material is only at the perimeter of the part. We don't do underfill of any degree in-house but a few years ago we did build a limited run of
Electronics Forum | Tue Oct 15 15:00:33 EDT 2002 | Steve Walters
Is there any info, guidelines or spec's on how many time you can rework a bga location?
Electronics Forum | Tue Oct 15 20:33:43 EDT 2002 | davef
First, this is a very interesting question. Second, there is no specification. Third, companies develop guidelines for rework based on their expectations for their product reliability. Things to consider are: * Motorola allows no product shipments
Electronics Forum | Sun Mar 07 19:58:03 EST 2004 | praveen
Hello , Can any body help in solving the problem of PCB warpage during BGA rework. I am using IR heating system. No problem found in reworking BGA's size less than 30mmx30mm but for 35 mmx35mm and above BGA get solder short due to PCB warpage. Note
Electronics Forum | Thu Nov 12 16:22:45 EST 1998 | Mike Cox
Any info on a BGA rework machine in the 10-20K range. Thanks Mike C
Electronics Forum | Thu Apr 22 11:59:36 EDT 2004 | Daniel
What is the best rework equipment on the market for BGA's and the pro and cons of others?
Electronics Forum | Tue Feb 20 10:47:19 EST 2001 | Massimo
Hi everybody, I need to collect some documentation about BGA rework, in particular I wolud like to know if there are some "theoretical" studies about this matter (for example a finite element model of a BGA suitable to be used to simulate BGA reflow)
Electronics Forum | Fri Mar 30 11:05:44 EDT 2007 | realchunks
Hi Chris, A lot of it has to do with your product, t-shooting devices and techs ability. There are ways to determine BGA are at fault. X-Ray is a good way to check for shorts. Insufficients are harder to find. Some people use a dye. They squirt
Electronics Forum | Tue Feb 20 13:37:45 EST 2001 | roland
I used the SMTnet search at the top of the page with the keyword "bga" and dropdown component "library" and came up with 14 references. You can also do a search using "BGA" as keyword and "forum" as the dropdown component to get some insight from "t
