Electronics Forum | Tue Mar 20 05:26:32 EDT 2007 | CL
Hi Chrissie, BGA Rework from one CM's view: 10% process problem (printing, reflow, voids, etc) 10% component failure (no other problem found) 80% "The board does not work therefore it must be the BGA" This, of course, is exaggerated. My point bein
Electronics Forum | Fri Nov 09 16:57:27 EST 2001 | davef
Sure, it�s fine to use the proper amount of flux and no solder when reworking BGA. Recognize that these new solder connections have less metal and a lower standoff than similar BGA solder connections that have not been reworked. This undoubtedly
Electronics Forum | Tue Mar 09 20:08:08 EST 2004 | davef
Warping BGA are the usual cause of shorts in the corners and are usually caused by the reflow profile. BGA have a natural tendency to warp due to CTE and package thermal mismatch, as you have seen at rework. The PBGA will go from a bowl shape to an
Electronics Forum | Fri Nov 09 20:15:26 EST 2001 | caldon
I concur with Dave.....I have done this often with little fall out. After rework reflow we would x-ray just to ensure an acceptable joint structure. Just for curiosity sakes....are you removing a defective BGA and replacing with a good one? Site pre
Electronics Forum | Mon Mar 19 08:26:37 EST 2001 | hany_khoga
Dear All: We have a problem of soldering big BGA's (3.5Cm * 3.5 Cm)during rework or repair. With three big companies stations (hot air & infrared) with their support, they faild to re-solder even one BGA succesfully. Note that we workes on a good te
Electronics Forum | Tue Oct 31 19:56:18 EST 2000 | Massimo
I'm reworking BGA with a "SRT Summit 2000". This machine uses a nozzle of the same size of the BGA to conduct nitrogen to the top of the BGA. When I rework big PBGAs (318PBGA, 388PBGA) I've got shorts at the corners (100% of the times!). I think the
Electronics Forum | Tue Mar 20 06:47:56 EDT 2007 | realchunks
I agree with CL. Most people blame the BGA cause it's a mystery chip to most people. Only after replacing the BGA several times do most people look else where. 90% of the time it's something else. Doing all your engineering work up front is the
Electronics Forum | Mon Mar 19 06:05:16 EDT 2007 | chrissieneale
Hello - what's coming up as the top reason for BGA rework? Are there more handeling issues than actual problems with SMT placement / rework? Sorry it's a really general question, but i'm after some really general answers. :) Chrissie
Electronics Forum | Tue Feb 20 16:56:36 EST 2001 | davef
There has been substantial amount of FEA done on predicting BGA ball reliability, but this has most often been applied to assessing the reliability of the design of products, rather than the effects of rework. This sounds like an interesting proje
Electronics Forum | Fri Oct 26 06:25:56 EDT 2001 | John
Undertaking tricky rework project to remove two BGA's in close proximity to two press fit dip sockets any guideline sone should use??? proceddure ,process control etc
