Electronics Forum | Sat Feb 19 09:26:19 EST 2005 | davef
Your customer asks a reasonable question. How do you know that your: * Paste has not dried? * Stencil aperatures have not become clogged? * On and on ... Some agrue that printing is the most critical process and that it drives all down-stream failu
Electronics Forum | Sat Jul 24 00:31:21 EDT 1999 | Scott McKee
| Has anyone ever heard of testing solder paste quality by pasting a board and making a determination of the quality by measuring paste height and width after the board is pasted. Would you consider this a valid test for solder paste testing? | I ag
Electronics Forum | Sun Apr 26 08:36:55 EDT 2009 | davef
First, in direct answer to your question, DOE printer setup variables (MPM): * Squeegee speed: 0.5 to 1.0 in/sec * Pressure (metal): 1lb/in of blade * Pressure (plastic): 1.6-3 lb/in Second, supprting earlier responses, most people monitor paste hei
Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef
Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c
Electronics Forum | Mon Aug 17 02:50:44 EDT 1998 | Bob Willis
| Have an SRT w/preheat, 18 layer board all copper, 456 BGA needs to be removed and replaced. The manufacturer is Chip Express and during reflow it warps up or down. Causing either opens or shorts on the corners. I was using gel flux with multiple
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