Electronics Forum | Mon Feb 12 10:02:18 EST 2007 | rgduval
A little late to the party here, sorry... Has the joint been verified as a cold solder joint? That is, visually confirmed that it looks like cold solder, and, perhaps, xrayed to confirm the solder status? X-raying may sound a bit extreme, but you'
Electronics Forum | Thu Feb 08 08:54:56 EST 2007 | jhaviland
groundplane not heating properly.. Is it a J leaded IC? sometimes these get bent slightly in the packaging and sit just far enough off the board to cause solder problems.
Electronics Forum | Thu Oct 27 00:45:41 EDT 2005 | pavel_murtishev
Good morning, I can recommend to use solder paste softeners, which can prepare solder paste for printing process. Softeners rise paste temperature by means of pseudo-planetary motion. Therefore, solder paste reaches room temperature during only 15
Electronics Forum | Thu Jun 23 11:56:51 EDT 2005 | wjxingggg
Hi, all. There is one 0.8mmX0.8mm QFN on almost of our PWBAs. But the quality report showed that we got bad solder quality for this component. My question is which elements are the root cause for this situation frequently? Thanks.
Electronics Forum | Fri Feb 24 02:04:50 EST 2017 | soldertraining
Selective Soldering Frames can pull large amounts of heat from the solder wave at the point of contact, effectively lowering the temperature of the solder at the solder joint. You should confirm the temperature of the solder joints by running a therm
Electronics Forum | Fri Aug 07 01:02:51 EDT 1998 | zeek - just wanna to get a word in here
| | I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and t
Electronics Forum | Mon May 24 09:52:06 EDT 1999 | john thorup
| | | Has anyone had any experience or data using vibration during the reflow process. | | | We introduced a vibration device attached to the fixed rail on a Vitronics reflow oven. The reason was to prevent skewing on large PLCC devices. The process
Electronics Forum | Sat May 09 23:05:17 EDT 2009 | kareal
Davef, It seems the tin resist residue on copper trace is root cause of whitish layer. but it could explian why I could not detect tin on fresh unit without UHAST. I have performed X-section and EDS analysis on many fresh units,but no any tin was
Electronics Forum | Mon Aug 09 11:47:52 EDT 2004 | MM
Hello, I'd like to consult somebody here about how to do the inspection of solderablity of a PWB. what is the root cause about the cold soldering in SMT.
Electronics Forum | Mon Sep 17 02:56:40 EDT 2001 | mugen
Hi, (me been absent for some time...) Are your brds confirmed HAL over copper? (check out what Dave F mentioned abt possible root causes) or are the brds HAL over nickle? (shd be no problem here, if so?) or are the brds strictly nickle plated pads?
