Electronics Forum | Wed Jun 09 17:29:59 EDT 1999 | Earl Moon
| I am starting a new project which involve 3 oz copper layer with 20 mil components on the top of the board and 0.040" thick copper with D2Pak on the bottom of the board. | There is anybody has experience on metal-based PCB reflow process? I guess
Electronics Forum | Thu Jun 10 11:23:10 EDT 1999 | Gang Pan
| | I am starting a new project which involve 3 oz copper layer with 20 mil components on the top of the board and 0.040" thick copper with D2Pak on the bottom of the board. | | There is anybody has experience on metal-based PCB reflow process? I g
Electronics Forum | Thu Jun 10 12:10:41 EDT 1999 | Earl Moon
| | | I am starting a new project which involve 3 oz copper layer with 20 mil components on the top of the board and 0.040" thick copper with D2Pak on the bottom of the board. | | | There is anybody has experience on metal-based PCB reflow process?
Electronics Forum | Sun Jun 13 07:57:15 EDT 2004 | Grant
Hi, We have been offered some lead free BGA parts in place of normal lead solder BGA parts in our process, and because we can get them faster it would be a good option. However does anyone know if we can use them as normal. I assume the balls won't
Electronics Forum | Wed Jun 16 11:38:50 EDT 2004 | russ
Am I getting confused here? What about the the CBGA packages that we have been doing for 5-6 yrs? We never reflowed those balls since we couldn't due to the alloy. I have been informed that if you increase paste volume to ensure a full fillet aroun
Electronics Forum | Fri Aug 03 14:44:36 EDT 2007 | rpadilla
Depends on the manufacturer of the paste... Rosin-based-flux solder paste usually takes 12-24hr's to fully oxidize with open containers. Water-based flux usually is 3-12hr's, but some have a 24hr open container shelf life... However, uncertain unt
Electronics Forum | Mon Jun 25 20:35:44 EDT 2001 | davef
According to J-STD-004 "Requirements for Soldering Fluxes", fluxes are classified by their chemical composition, activity level and halide content. In this scheme, each flux type is identified by a 4-character designator, where: * First two character
Electronics Forum | Thu Nov 30 00:41:23 EST 2017 | abhilash4788
Dear All, I have OSP finsh pcb on my production, the pcb thickness is 1.5mm and the product is one sideded pcba. After reflow process, Is there any specific time frame defined for smt completed OSP finish pcba before going for wave soldering proce
Electronics Forum | Wed Dec 06 09:09:54 EST 2017 | davef
Suppliers have improved the utility and quality of OSP [organic solderability preservative] solderable surface protection over the years. Be cautious reading too much into older SMTnet [and web in general] conversations about handling OSP. When prop
Electronics Forum | Sat Aug 05 12:12:05 EDT 2000 | Ramon I Garcia C
Hello Friends: I'm new in SMT process, I have a problem with little balls of solder beside of the component, I'm tried reducing the apertures in the stencil and making home base, some times the balls desappear, but some time not, and some times
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