Electronics Forum | Thu Jan 29 09:18:36 EST 2015 | davef
Nichrome, manganin, phosphor bronze etc are easy to solder ... the hard part is removing the corrosion * Manganin: 86% copper, 12% manganese, 2% nickel. Often, it's used in making cryogenic measurements, due to its low heat loss. * Select a flux for
Electronics Forum | Tue Apr 16 05:05:32 EDT 2013 | stivais
We recently had a discussion with customer's QM - he claims that calculations for a proper solder wire diameter and soldering iron tip size (and temperature) have to be performed and documented for all manual (T/H) solderings (based on component size
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
Electronics Forum | Wed Nov 01 07:32:33 EST 2006 | davef
What you have run up against is the unfortunate consequence of the transition period from Sn-Pb to Pb-free. In the past 2-3 years there have been several studies highlighting the differences in reliability between mixed metal systems, Sn/Pb, and SAC
Electronics Forum | Mon Jun 25 20:35:44 EDT 2001 | davef
According to J-STD-004 "Requirements for Soldering Fluxes", fluxes are classified by their chemical composition, activity level and halide content. In this scheme, each flux type is identified by a 4-character designator, where: * First two character
Electronics Forum | Thu Nov 18 10:56:16 EST 1999 | Dave F
Jacky: There�re major four factors that affect the reliability of a solder connection. 1 Design of the connection including the shape and height of the lead and the type and amount of solder. 2 Dissolution of base metals into the solder connection.
Electronics Forum | Fri Aug 03 14:44:36 EDT 2007 | rpadilla
Depends on the manufacturer of the paste... Rosin-based-flux solder paste usually takes 12-24hr's to fully oxidize with open containers. Water-based flux usually is 3-12hr's, but some have a 24hr open container shelf life... However, uncertain unt
Electronics Forum | Fri Jun 30 20:39:52 EDT 2006 | johnwnz
Grant, Haven't doen any work with the SN100C paste, the problem I guess is yoru subject to the suppliers flux base so if that is poor then the alloy may not perform as well as it could. We've found Avantec to be pretty good at SMT but have got SN100C
Electronics Forum | Thu Nov 30 00:41:23 EST 2017 | abhilash4788
Dear All, I have OSP finsh pcb on my production, the pcb thickness is 1.5mm and the product is one sideded pcba. After reflow process, Is there any specific time frame defined for smt completed OSP finish pcba before going for wave soldering proce
