Electronics Forum: round (Page 5 of 44)

Re: VME Assemblies

Electronics Forum | Mon Apr 27 11:04:12 EDT 1998 | Dave

| I realize this is a SMT forum, but I have another | problem related to electronics assembly and hope there | will be someone out there that can save my life (this | time). | We build quite a few VME assemblies to which we attach | a SAM board. Fai

VME Assemblies

Electronics Forum | Fri Apr 24 14:18:40 EDT 1998 | Scott Davies

I realize this is a SMT forum, but I have another problem related to electronics assembly and hope there will be someone out there that can save my life (this time). We build quite a few VME assemblies to which we attach a SAM board. Fairly standard

Re: VME Assemblies

Electronics Forum | Tue Apr 28 10:09:59 EDT 1998 | Scott Davies

| | Where can I find pliers to accept a round standoff? | Scott: Two ideas come to mind: | 1. change the stand-off round to to a hex shape | 2. if you must use the round shape, go to Sears, buy a "robogrip" and a pack of the platic inserts that fi

Re: VME Assemblies

Electronics Forum | Mon Apr 27 06:46:39 EDT 1998 | Greg Curler

| I realize this is a SMT forum, but I have another | problem related to electronics assembly and hope there | will be someone out there that can save my life (this | time). | We build quite a few VME assemblies to which we attach | a SAM board. Fai

0402 pad and stencil aperture design

Electronics Forum | Thu Oct 30 15:07:40 EDT 2008 | jemills

Hello I have a new 0402 pad design on a recent board were building in future. On closer look i thought the pad was a thru hole mount , but upon closer inspection the round pads are for 0402 comps. I had a discussion with the engineer and he said

Re: fiducials

Electronics Forum | Mon Jun 14 09:33:54 EDT 1999 | Adam Pratt

| In past PCB designs I have cleared all traces from all layers | (except pwr/gnd) from fiducial area. It has come to my attention that this is only necessary on the side where fud is placed. Which is the correct method of design using a fidicial?

Soldermask Defined BGA Pads

Electronics Forum | Thu Oct 14 17:14:39 EDT 2004 | mattkehoe

We are experiencing a problem with soldermask defined BGA pads not accepting solder during the reflow process. The paste is there when the boards come off the printer but after reflow, no paste. Some other pads in the same pattern are fine. Here is t

CP6 Nozzle sticking

Electronics Forum | Sat Jan 21 20:20:38 EST 2006 | Curt Couch

Sir, reverse wound springs do help this situation. I would also recommend using acetone in the wind mills, its made of 440C SS and has R/c hardness of 58-60 you need to use something that will cut the gauling deposits left from the aluminum in the no

Dedicated or adjustable fixtures for Universal Radial Inserter

Electronics Forum | Thu Aug 30 11:02:51 EDT 2007 | gmoritz

... talking two-lead LEDS with 2.5mm pitch ... Yes. That's what we are working with. > are the LED terminals shape were Square or > the naturally rounded? Some are round. Some are square. One is U-shaped. > Due to different insert rotations,

SMT electrolytic capacitor lead classification is???

Electronics Forum | Tue Dec 02 07:56:40 EST 2008 | realchunks

Wow, rocket science with Nasa specs! I like it. I don't see the trick question here, so I'll continue.... IPC simply states over hang of round or flattened (coined) leads is acceptable (class 1, 2, & 3) if it "does not violate minimum electrical c


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