Electronics Forum: rubber squeegee in screen printing (Page 1 of 2)

Re: Plastic Stencils for screen printing ahesive

Electronics Forum | Wed Apr 08 11:30:03 EDT 1998 | mpark

Clint, You may want to call KJ Marketing Services, a Canadian company that fabricates plastic laser cut stencil. They call it "Kepoch stencil" This material was originally developed by Dupont, and patented and marketed by KJ. It was available for

Re: Proflow of DEK screen printer

Electronics Forum | Wed Sep 08 08:25:26 EDT 1999 | Brad Kendall

Listed below are the issues Viking has been experiencing since the | installation of the Proflow Head: | 1. After installing new 350mm Wiper foil with metal | strip glued on it, It worked for about a week and suddenly meta

Re: Proflow of DEK screen printer

Electronics Forum | Tue Sep 07 15:28:13 EDT 1999 | Earl Moon

Listed below are the issues Viking has been experiencing since the installation of the Proflow Head: 1. After installing new 350mm Wiper foil with metal strip glued on it, It worked for about a week and suddenly metal stri

Re: problem in micro-BGA assembly

Electronics Forum | Mon Jun 28 11:51:36 EDT 1999 | Brian Wycoff

| | | | Dear guys, | | | | | | | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thicknes

Air Moisture in Production

Electronics Forum | Wed Dec 08 11:26:04 EST 2010 | davef

3 Printer Area Conditions * As stated earlier, heat and humidity are damaging to solder paste. Ideally, the printing area should be maintained at 40% - 50% relative humidity and 72°- 80°F (22-26°C). In addition, no air (cool or warm) should blow dire

Re: problem in micro-BGA assembly

Electronics Forum | Thu Jun 24 15:58:46 EDT 1999 | Adam Pratt

| | Dear guys, | | | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are no

Re: problem in micro-BGA assembly

Electronics Forum | Thu Jun 24 23:52:36 EDT 1999 | Dean

| | | Dear guys, | | | | | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We

Setting limits in Solder Paste Inspection

Electronics Forum | Sat Apr 21 04:39:45 EDT 2012 | brotakul

I am using different equipements for SPI such as Koh Young and Cyber Optics machines. I am looking for implementing a general procedure (SWP) for setting LSL's and USL's on the products on which the customer does not specify any limits on the solder

Stencil Printing: Single pass vs. Double pass

Electronics Forum | Thu Dec 20 08:00:50 EST 2007 | avalancher

Many years ago, we used to double print. The way we did it was with a rubber squeegee set to do a flood stroke, followed by a return cleaning stroke with a metal squeegee. Why?! Well, this was in the days before Laser etch, and because the chem bat

Screenprinting Adhesives

Electronics Forum | Fri Apr 12 15:43:25 EDT 2002 | Fuji Spares

Screening adhesive can be messy but is alot quicker than using a glue machine as long as you setupyour stencil machine either manual or machine, we also use steel stencils with a stainless squeegee but you can use a rubber squeegee not sure about pre

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