Electronics Forum | Mon Nov 02 17:45:46 EST 1998 | ChrisK
In my experience, solder balls are normally caused by only a few things. In order of likelyhood: 1) Water based fluxes (VOC-Free)not having the water carrier completely dried from the board before going into the solder. I.E, too fast conveyor spee
Electronics Forum | Fri Oct 30 18:08:59 EST 1998 | Dave F
| I finally got my problem figured out on the bridging, the | only thing I'm finding is that I notice some litlte solder balls on the bottom of the board. Is that normal? Is that why I'm getting bridges? Has anyone came across this problem and pass t
Electronics Forum | Thu Jun 22 15:05:55 EDT 2017 | solderingpro
There are several different technologies in the industry today to assist in the out-gassing of flux cores. On automated soldering systems, there are two main types of perforating solder feeders: - Hole Drilling - "V" Scoring By perforating the so
Electronics Forum | Wed Oct 17 17:43:27 EDT 2001 | davef
2) Open time: A 15-minute queue between paste, place, and reflow SB fine, assuming humidity is not too great. 3) Wash temperature: Yes. A wash temperature of 130-140�F SB fine. 4) Reflowed board was left too long prior wash: Are you washing: * After
Electronics Forum | Tue May 19 10:23:06 EDT 1998 | Mike C
| Howdy Richard, | Welcome to the club! I now dub thee a full fledged member of the "Spotty Gold Finger and Bleeding Ulcer Society"...or SGFBUS for short... (GRIN) | I know it's not funny to be in that position, but there's so many different places t
Electronics Forum | Sat Feb 05 09:08:18 EST 2000 | Dave F
Casimir: Let me expand on something that I said in my response to your thread on ionic testing. Generally, no-clean people don�t use ROSE testing as part of their process control, because the ROSE test is essentially washing your board in DI/IPA �
Electronics Forum | Thu Oct 26 11:49:54 EDT 2006 | sms_don
CW, The good news is that you are not trying to use SAC paste with SnPb balls for that would be a void generator due to the ball being liquidous while the SAC paste is still in a flux cleaning stage. Two points to consider: One, voids are not an i
Electronics Forum | Thu Oct 05 07:58:05 EDT 2006 | realchunks
I have noticed certain BGAs void more than others. We place about 8 different brands of BGAs and only one brand voids like crazy and we have to adjust for it.
Electronics Forum | Wed Oct 04 14:14:49 EDT 2006 | russ
Change mfgrs of paste OR better yet use pbfree paste, If you are collapsing the balls on the BGA then you are possibly overheating the paste/flux quite a bit. most lead pastes do not like much more than 230 C. I am assuming that you have a decent p
Electronics Forum | Wed Oct 04 14:18:05 EDT 2006 | C.K. the Flip
The main cause of voids is your flux out-gassing during reflow. Try a little "knee" or slight soak in your thermal profile to dry out the volatiles a bit. Typical soak ranges from 130 deg. C to 170 deg. C for around 30-90 seconds.
