Electronics Forum | Wed Jul 27 17:18:07 EDT 2005 | Carl
Any issues in your experience using SAC305 for reflow and SN100C for wave on ENIG pcbs? I've seen the CD, but there's not much specific data regarding ENIG pcbs Thanks
Electronics Forum | Mon Nov 19 10:37:53 EST 2007 | ck_the_flip
Bruce, Does the thicker barrel plating for "RoHS-Rated" PCBs alleviate some of the copper dissolution that one might experience from SAC305? Also, for those SN100c experts out there, is Sn100c less likely to dissolve copper?
Electronics Forum | Fri Mar 03 14:43:04 EST 2006 | amol_kane
the latest circuits assembly mazagine features an article on this by Karl Seelig
Electronics Forum | Thu Apr 06 18:22:53 EDT 2006 | russ
Anyone using the new SACX from Alpha?
Electronics Forum | Fri May 05 09:00:46 EDT 2006 | russ
Studies showed that there are no issues mixing SN100C and SAC305, I believe that AIM has this info. Russ
Electronics Forum | Fri Jan 20 08:27:28 EST 2006 | Loco
Just wondering what the companies that are use SN100C are using for reflow (I guess SAC), and especially for handsoldering. Do SAC and SN100C mix? are there any studies proving this?
Electronics Forum | Fri Nov 09 12:42:08 EST 2007 | wayne123
Smt paste= SAC305 Wave Solder= SN100C no real problems with either of these. good luck
Electronics Forum | Thu Dec 29 22:19:36 EST 2005 | Joseph
We have tested SN100C for LF wave soldering process since August'05 and currently start production for a month ago. Initially we use SAC305, but due to the shrinkage cavities (micro-crack) we changeover to SN100C. In summary, SN100C did perform well
Electronics Forum | Fri Feb 24 15:15:33 EST 2006 | russ
The No-Clean indium lead free paste runs well. We discontinued because of extremely high shipping costs. We can get the same results with cheaper product. Almost all of the discussion in this forum about SAC305 and SN100C have to do with wave sold
Electronics Forum | Wed Feb 04 08:39:46 EST 2009 | smartasp
Hi The issue is not the equipment or any other technical matter. The point is that the argument is about the 10 deg C higher melting point. The process window of SN/CU is somewhat smaller but manageable. I know Nihons web site but found not enough i
