Electronics Forum | Thu Oct 23 12:31:56 EDT 2008 | jdumont
We use Cooksons prepaid "Pot-Rite" program which sends you as many preaddressed envelopes and order sheets as you order. When it comes time to send out a sample you just pop it in the envelope and mail it out. They also have all the molds and ladles
Electronics Forum | Tue Feb 27 18:16:42 EST 2001 | davef
I have never seen excess tin [heard of it, just never seen it]. Excess lead yes, but tin no. See, tin oxidizes faster than lead. This means that dross has a higher tin content than the solder in the pot. So, with a very high dross machine, we regul
Electronics Forum | Mon Nov 22 11:16:04 EST 1999 | Boca
Chris, Some ramblings- Your choice depends on factors like which defects you're looking for, bugdet, quality inspection philosophy, high or low mix environment, sample sizes or 100%, and so on. Are you going to test 100% of the product coming off t
Electronics Forum | Thu Sep 09 04:51:19 EDT 2004 | Simon UK
65%), if one failed on the board i replaced all of them, and re-tested and thermally cycled them inline with our spec (-55/+80 Deg/C for 48hrs) this was a nightmare, especially when some cracks were not detected until several weeks later while flying
Electronics Forum | Tue Nov 09 13:12:26 EST 1999 | Dave F
Steve: Sure, but let's figure it out for you!!! ;-) Here�s some sample calculations. Your results may vary, void where prohibited, etc 20 PITCH: Pinched aperture volume: 0.010"X0.050"X0.005" = 2.5 uin^3 Zippered aperture volume: (0.015"X~0.5)
Electronics Forum | Wed Sep 02 08:44:50 EDT 1998 | Kelly Morris
| Hi, | We are having problem with yield loss due to electrical fail. Further investigation shows that the failure is due to solder bridging under BGA. Has been there any study or experience on how this could occur and what we can do to prevent it.
Electronics Forum | Tue Apr 29 15:45:09 EDT 2003 | davef
We have mixed bar solder from alternate suppliers in our wave soldering machine. Issues that you need to address before changing your solder supplier are: * Assure that the alloys are the same. In this, consider imaginative people may be reporting
Electronics Forum | Sat Apr 15 09:07:22 EDT 2006 | samir
Amol, We pulled off this "hybrid profile" with a leaded solder paste. We recently got our tensile test report results, and our Pb-Free BGA / Pb Paste sample broke off during tensile tests at the pad/substrate interface, and not the joint. This ind
Electronics Forum | Thu Sep 11 15:23:31 EDT 2003 | Peter L.
I have come across a rash of failed assemblies that have 0805 capacitors and resistors, bottom side glued, wave soldered and washed. Trouble shooter reported touching up the solder joints on a few areas and the boards would pass test. I had a look a
Electronics Forum | Mon Mar 25 15:51:04 EST 2002 | davef
ASQC re-numbered the once free (taxpayer sponsored development) MIL-STD-105 as ASQ-Z1.4, slapped their own cover on it, and now charge $40 or $50 for the same document! The standards are identical, so see if you can get one of the old �MIL-STD's� and
