Electronics Forum | Fri Jun 07 14:05:39 EDT 2024 | davidk
I wanted to open a discussion and ask about opinion: What is a normal result of the inspection of an AOI? How many falls calls per component /opportunity is bad/normal/good? How many defects per component/opportunity is bad/normal/good? What is goo
Electronics Forum | Thu Jun 13 14:41:40 EDT 2024 | tommy_magyar
Hi David, In one of my previous jobs I worked as an AOI/AXI process engineer and we had a set target of 75% FPY. This means that 75% of the boards at IPC Class 3 standards would not have a single false call. This also means you would need to set y
Electronics Forum | Wed Aug 07 17:05:41 EDT 2024 | pradeep14
We are a high mix low or middle volume production. We are using 3D AOI MIRTEC. How to reduce the false cals. Every batch we are adding more samples to the program but we can't able to reduce the false call ratings. Suggest how to control the FALSE ca
Electronics Forum | Mon Nov 22 11:16:04 EST 1999 | Boca
Chris, Some ramblings- Your choice depends on factors like which defects you're looking for, bugdet, quality inspection philosophy, high or low mix environment, sample sizes or 100%, and so on. Are you going to test 100% of the product coming off t
Electronics Forum | Tue Nov 06 06:23:31 EST 2007 | clampron
Good Morning Roger, The Mirtec's can be adjusted to lower your false call rate. This can be done by reducing the matching percentage for each componnent but the result of this action is that the machine becomes less selective. If you lower them too
Electronics Forum | Wed Jan 26 07:18:13 EST 2005 | clampron
Good Morning TM, We have a table top AOI (actually several of them) We did a side by side evaluation when we first looked at it. We looked at Qualectron, NSpec and Mirtec (Samsung at the time). Some of the criteria that was important to us: *Librar
Electronics Forum | Thu Sep 19 21:46:01 EDT 2002 | scottefiske
In the past year I was responsible for developing and leading a Team focused on AOI, Evaluation, Justification, and with a full ROI required, supporting a HMLV manufacturing environment. If you have in these economic times the additional resources t
Electronics Forum | Fri May 15 17:31:04 EDT 1998 | Steve Abrahamson
| | | | We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | | | | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin
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