Electronics Forum: sats (Page 1 of 7)

SOT Solder Problem

Electronics Forum | Fri Sep 12 09:33:18 EDT 2008 | realchunks

When you sat design problem, is it a because there is a ground plane causing a thermal problem?

Re: BGA open

Electronics Forum | Thu Sep 02 11:50:58 EDT 1999 | ScottM

| Could someone shares their experience on the causes of 'Open' in the BGA after reflow. | | Insufficient solderpaste. "No flux" (sat too long after print). Those are what I've experienced. Cheers, Scott

Fog Test

Electronics Forum | Fri Jul 26 18:28:51 EDT 2002 | blnorman

Actually this is for an automotive instrument cluster. From what I've been told back in the good old days we switched fluxes and after the car sat in the sun (and heat) a haze developed on the inside of the panel that was attributed to the flux.

dsp shiffting

Electronics Forum | Wed Apr 13 14:54:21 EDT 2005 | vikkaraja

It is QFP 208 legs. I have sat by the machine for hours and did not see a problem before the oven. I walk away from it and get a call again.

silkscreen issue

Electronics Forum | Sun Mar 12 18:20:08 EST 2006 | jldowsey

Thanks Russ. As it turned out, it was an incomplete cure at the fab house. Rhey sent another fab over from the same lot that had sat for 3 more days, and it came out lavender instead of purple! have a good one!

Line tech in need of help

Electronics Forum | Fri Mar 09 10:58:00 EST 2001 | davef

Wait, wait, wait ... I'm not completely sure what a line tech does, but I was his / her boss, I would not be happy if the first thing my new line tech [or any other employee] did was to suggest that I go out and spend BIG $$$ [especially before he /

16 mil pitch QFPs / solder paste type 4 & 5?

Electronics Forum | Mon Apr 07 09:52:07 EDT 2003 | kmorris

I have just started an assembly which uses a 16 mil pitch QFP. We ran on Saturday, using a type 3 solder paste. (working Sat's really sucks) We really struggled with paste release after the stencil sat for 15 minutes without printing. Apertures clog

Adhesive printing with double side board

Electronics Forum | Tue Jul 24 10:23:36 EDT 2007 | ck_the_flip

Michelle, Traditionally, the adhesive side is always run first since most designers put passives (resistors, caps) on the adhesive (solder side) of the board. I worked in an environment where we did the adhesive side first, sometimes the boards "sa

Re: 0201 Capacitor Solder Printing

Electronics Forum | Tue Jan 04 11:25:34 EST 2000 | Brian E. Steelglove

John, I work for Panasonic Create and I just got back from Japan where we sat through a presentation on pad layout and stencil layout on the 0201. Please give me your fax number and I will send it right over. Sorry I do not have it on disk. Bria

Lead Free soldering profile for SMT

Electronics Forum | Fri Jun 06 22:10:11 EDT 2003 | MA/NY DDave

Hi John I believe gave a good answer with cautions. The .001 or .1% is the main criteria that internationally means you are Lead-free per JEITA, the EU and NEMI. They sat around at a table and decided is how they got the .1% John did note that yo

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