Electronics Forum | Thu Feb 26 13:29:36 EST 2015 | swiese242
Use the appropriate heat for that part. You can then use techspray flux remover with a brush. Spray the brush, and not the board, to reduce spreading the flux. Acetone or alcohol are less expensive and may work as well.
Electronics Forum | Sun Feb 13 01:35:55 EST 2000 | Dean
Without further information my first guess would be lack of flux to "cut through" the ENTEK layer. Question: In X-ray is the suspect ball of equal diameter when compared to adjacent balls? If no then the volume of solder is different which would po
Electronics Forum | Thu Jul 09 11:13:00 EDT 1998 | justin medernach
| IS IT BETTER FOR SOLDER PASTE TO SPREAD OUT AS FAR AS POSSIBLE ON BARE COPPER, OR FOR IT TO KEEP THE SHAPE OF THE PRINT? I'VE BEEN DOING SOME SOLDER PASTE EVALUATIONS, AND I'M TRYING TO EVALUATE THE RESULTS. I'M NOT SURE THAT BECAUSE A PASTE MAY
Electronics Forum | Thu Jun 02 22:26:46 EDT 2016 | slouis2014
i have tried to design the stencil as attached, but the void is more than 35%. do you have any idea what is the ideal diameter for the stencil aperture for the solder to spread and the flux to be released out of the component simultaneously. thanks a
Electronics Forum | Mon Feb 13 10:41:14 EST 2017 | dyoungquist
Could be that your temperature ramp up rate is too fast. This could cause the flux in the solder paste to burn off too rapidly. When that happens, it can expand as it heats up and burns off, causing the solder to get spread out from the pad.
Electronics Forum | Mon Mar 07 20:27:07 EST 2005 | KEN
Oh silver and its...improved solderability over tin / copper. BS if you ask me. Look to your flux and thermal profile for wetting spread. Ask yourself just how much "wetting spread" do you need to fill a barrel? I have the same 100% barrel fill
Electronics Forum | Wed Aug 23 16:29:16 EDT 2000 | Dr. Ning-Cheng Lee
The surface tension of solder you mentioned should be referred to as interfacial tension between solder and flux. According to Antonow�s rule, the interfacial tension is the difference in surface tension of molten solder and liquid flux. Since flux a
Electronics Forum | Fri Mar 23 11:58:01 EST 2001 | mparker
You are mixing long exposed paste back into fresh? How long has your fresh jar been open to the air? You are probably doing yourself a disservice by scavenging the paste (it could have moisture entrapped). Your visocity has definitely changed. You a
Electronics Forum | Wed Apr 18 01:07:25 EDT 2001 | MW
I some something like this. My package was not flat the belly of the body rested on the PCB. We found that every 4-5 part would wander to the side. What was puzzling is that the blowers would have blown it the opposite side. ultumately we proved
Electronics Forum | Wed Dec 21 17:11:58 EST 2011 | davef
Kim: We understand what you're saying. For us, fluxing the BGA and activating the flux are the issues. * If you're squirting liquid flux under the BGA with a plastic bottle with a needle tip on it and then reflowing less than the whole board with a
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