Electronics Forum | Tue Oct 13 22:22:14 EDT 1998 | mike
| All Y'll | | How do you clean components that must be added to an assembled board after water wash? | | BACKGROUND | | Our basic process goes like this: | | 1 Print paste with OA flux, place, reflow, wash | 2 Repeat 1 | 3 Insert PTH, OA flux
Electronics Forum | Tue Sep 28 17:56:02 EDT 2004 | Vee Sar
Adam, I would first check hole to lead sizes on the components that you are having hole fill issues with to see that the spacing is withing spec. Second, check for oxides on lead tips, and contaminated leads that cause poor wetting and insufficient
Electronics Forum | Thu Sep 23 11:56:30 EDT 2004 | rkevin
We are printing on an assembly using SAC305 Alloy Sn96.5 Ag 3 Cu .5 with a no clean flux and getting virtually NO spread with either a ramp to spike or straight ramp profile. We are printing to standard FR4 board with immersion Ag finish. I am trying
Electronics Forum | Mon Nov 06 21:09:47 EST 2000 | Dave F
That's cool that you used the Archive. Consider running a designed experiment on your board, using your flux and solder, the limits from the Archive, and on your machine to dial in the spread in dwell numbers you see in the SMTnet Archives to your s
Electronics Forum | Wed Apr 30 07:33:12 EDT 2008 | davef
It's not acceptable to us. More importantly, you need to determine if it's acceptable to your customer. Recognize that your little IPA scrub does NOT remove the OA flux residues from the board. It mearly spreads them out across the board and under c
Electronics Forum | Tue Jul 30 17:47:50 EDT 2002 | davef
Dewetting: Solder does not adhere to lead or land, caused by: * Poor solderability of lands. * Poor solderability of leads. * Solder paste integrity. * Lead plating integrity. Need more information, please: * What is dewetting [ie, component, pad, e
Electronics Forum | Thu Oct 15 13:55:43 EDT 1998 | Steve A
Dave, The first step would be to learn to accept the residue. IPC class 2 has no problem with it. If that is not possible, I am not sure why a no clean is necessary- but I will take your work for it. Alcohols will dry out the residue, and turn it
Electronics Forum | Thu Oct 15 16:39:07 EDT 1998 | Dave F
Steve: I thought Kyzen products were "additives" to either aqueous or semiaqueous inline or batch machine cleaning processes. I'm trying to clean the no-clean residue from a few components that can not bear to see water. Can you use Kyzen products
Electronics Forum | Wed Feb 07 21:56:00 EST 2001 | davef
Every critter out there with large incisors adapted for gnawing and nibbling has a different theory of solder ball formation. [My theory: It�s punishment for using NC fluxes. Stand and deliver. My solder balls end-up in the gross filter connected
Electronics Forum | Sat May 27 02:52:20 EDT 2006 | TimS
Gentlemen I have managed to pull myself together after banging my head. I am not sure the flux volume is the total solution here. All spray processes deposit flux in a similar manner, that is to say the vast majority of material sprayed onto the PCB
