Electronics Forum | Tue Oct 13 15:38:23 EDT 1998 | Dave F
All Y'll How do you clean components that must be added to an assembled board after water wash? BACKGROUND Our basic process goes like this: 1 Print paste with OA flux, place, reflow, wash 2 Repeat 1 3 Insert PTH, OA flux, wave, wash 4 Insert
Electronics Forum | Tue Oct 13 17:30:09 EDT 1998 | Upinder Singh
| All Y'll | | How do you clean components that must be added to an assembled board after water wash? | | BACKGROUND | | Our basic process goes like this: | | 1 Print paste with OA flux, place, reflow, wash | 2 Repeat 1 | 3 Insert PTH, OA flux
Electronics Forum | Thu Jul 07 16:46:52 EDT 2005 | adrian
I am using pretty often the re-balling Winslow Automation kit for many BGA packages we have to re-ball. When I have started doing this, I've tried to use "BGA REBALLING INSTRUCTION" manual (PR-4048 REV.F), but it didn't work. For some reason, althoug
Electronics Forum | Wed Dec 09 09:47:32 EST 2009 | dyoungquist
I am curious as to why you need to mix.... We use a 500g cartridge with air gun. Our process is remove the cartridge from the fridge, allow it to warm up to room temperature before inserting into air gun, then apply bead of paste to the stencil. N
Electronics Forum | Thu Aug 30 20:35:51 EDT 2012 | davef
A common bottomside heater configuration is IR-Convection-Convection. One of the big advantages of the IR zone is its ability to allow the flux carrier to spread and dry slowly before the board reaches the convections zones, which can blow wet flux c
Electronics Forum | Tue Nov 14 08:52:07 EST 2017 | davef
If you think the problem is occurring in the box and it is wide spread, consider replacing your solder paste with your paste supplier. There are paste formulations aimed at the solder balling issue that some LF pastes create. On tuning your reflow r
Electronics Forum | Tue Nov 02 17:52:17 EST 1999 | Dave F
Jim: Several points: 1 If you�re correct about corrosion of your component leads (which is entirely possible if the leads are steel, as you say), then the AIM 264-5 no-clean may not be aggressive enough to remove the corrosion you are seeing routin
Electronics Forum | Tue Feb 10 15:13:06 EST 2004 | patthemack
Hey Vinny, Sorry I haven't looked at this for a while. 3 things to try: Tombstoning- The ground plane side is larger because the solder mask allows for a little slop at the board shop (clearance around a pad of a few mils). Since there is not a defi
Electronics Forum | Tue Oct 13 18:28:51 EDT 1998 | Graham Naisbitt
Upinder, Using IPA does not cause the residue, it simply exposes it. Given that all fluxes leave reisdues, it follows that these MUST be benign - but how do you know, and how do you control it. You are using flux to remove oxides and give you a go
Electronics Forum | Thu Aug 26 16:48:37 EDT 2004 | davef
You're correct. Operators shouldn't be doing "touch-up". [No value added] Take that as your clue for areas to improve process. Babbling about touchup: * Left to itself, touchup feeds on itself, operators are parinoid that inspectors will "ding" th
