Electronics Forum | Mon Apr 25 16:25:07 EDT 2005 | Mike Konrad
Hi Carl / Bill, I seem to miss your point regarding disclosure. As I CLEARLY stated, it is the perception of damage more than the possibility of damage. As a twenty year veteran of de-fluxing systems, I can assure you that there remains enough con
Electronics Forum | Tue Jul 04 02:31:55 EDT 2006 | Mustang
Calling for an input from the Experts our there. Our customer is questioning the cleanliness of the no-clean product that we produced for them. We were asked to clean the board (localised cleaning) after rework (IC need to be changed due to an up re
Electronics Forum | Wed Dec 24 18:31:04 EST 2008 | hegemon
If they share a common ground plane you are in for some difficulty in trying to prevent the second part from heating too much. What happens to the underfill material when it is softened by being heated beyond the 160C? Does it harden up again, or b
Electronics Forum | Wed May 09 10:40:10 EDT 2001 | davef
First, your primary side component pads should be designed according to SM-782A, "Surface Mount design & Land Pattern Standard". Next if you did that and your secondary side component pads are the same size as your primary side components, your diff
Electronics Forum | Thu Jun 04 11:23:25 EDT 1998 | Justin Medernach
| What methods do people use to dress pads after removing and before replacing the BGA? | We use solder wick and a soldering iron, focusing on not "dragging" the wick across vias. This is laborous and booring. Who has a better way? | Dave F Dave, Her
Electronics Forum | Thu Jun 04 22:36:23 EDT 1998 | Dave F
| | What methods do people use to dress pads after removing and before replacing the BGA? | | We use solder wick and a soldering iron, focusing on not "dragging" the wick across vias. This is laborous and booring. Who has a better way? | | Dave F | D
Electronics Forum | Sat Sep 08 08:55:24 EDT 2007 | davef
We expect to see a copper shadow along the edge of pads when soldering boards with organic solderability protection [OSP]. IPC-A-610 has defined this as acceptable for years. During early reflow stages, the flux in paste dissolves the OSP where ther
Electronics Forum | Mon Dec 17 11:55:08 EST 2007 | chef
I recently had the same problems, solder bridges on every thing I made, different customers boards, etc. I wave with no-clean flux. As I sorted out problems (pin holes, blow holes, splatter, etc.) I found a lot of variable factors. I changed flux,
Electronics Forum | Thu Feb 17 21:45:26 EST 2000 | Dave F
Steve: Wadja mean "I fixed it, now tell me what I did to fix it." Steve, you�re one scary guy. ;-) "Steve�s Longer Pad Theory" - Stubby pads will not make solder flow-up the leads of a QFP100, leaving sparse solder on the pads. Given a choice, s
Electronics Forum | Thu Feb 17 21:45:26 EST 2000 | Dave F
Steve: Wadja mean "I fixed it, now tell me what I did to fix it." Steve, you�re one scary guy. ;-) "Steve�s Longer Pad Theory" - Stubby pads will not make solder flow-up the leads of a QFP100, leaving sparse solder on the pads. Given a choice, s
