Electronics Forum: scavenger flux spread (Page 10 of 10)

solder paste

Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef

Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c

Re: Solder FINES vs. Solder Balls

Electronics Forum | Sun Apr 18 00:26:29 EDT 1999 | Vic Lau

| | | | | Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? | | | | | | | | | | I consider "fines" individual unmelted metal sph

Re: Brush-Up Your Intermetalics!!!

Electronics Forum | Thu Jun 17 22:10:48 EDT 1999 | Earl Moon

| | | Does anyone know where I can find a list of things to do to when troubleshooting issues during the wave solder process? | | | | | | for example: | | | | | | Solder Bridge | | | 1.verify amount of flux been aplied. | | | 2.verify turbulance on

Books for SMT

Electronics Forum | Tue Jan 16 20:34:17 EST 2007 | davef

DAVE�S BOOKSHELF ASSEMBLER�S ESSENTIALS Title: Soldering in ElectronicsAuthor: RJ Klein WassinkPublisher: Electrochemical PublicationsISBN: 090115024XPublication date: December 1989 I know, I know. The book was written in 1989!!!! I use this b

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