Electronics Forum | Thu Dec 16 15:00:20 EST 2004 | glaucon
Simple differences. Both processes require a very similar machine platform, controlled motion, vision fiducial recognition and alignment of a substrate (PCB or hybrid ceramic) to the "image", the image being either a stencil (hence stencil printing)
Electronics Forum | Mon Aug 15 10:07:21 EDT 2016 | capse
In screen printing the material is transferred through openings in the screen mesh. You can imagine small columns of "ink" that coalesce after the screen releases. Screen printing is also an off-contact process verse contact process of stencils. The
Electronics Forum | Fri Jul 24 17:02:37 EDT 2015 | cnotebaert
Id say get them panelized to help lock it down in a basket or under a screen, we actually started making our own baskets out of screen material, tight mesh and not as rough. the other option would be to get something to hold them off the wash conv ho
Electronics Forum | Tue Sep 14 10:24:53 EDT 2004 | pjc
MPM is a printing machine design and mfg company based in Franklin MA USA. Printing machines are used to deposit hi viscosity materials such as solderpaste, adhesives and silver epoxy used by the electronics assembly and semi-conductor industry. The
Electronics Forum | Tue Oct 24 19:40:40 EDT 2000 | Dave F
From the SMTnet Library Terms & Definitions [er whatever they call it] � Emulsion. A material that suppliers build-up on a printing screen to block portions of the screen. The un-blocked (open) portion of the screen define the pattern for depositi
Electronics Forum | Thu Oct 14 18:23:40 EDT 2021 | mikeybinec
OK, thanks for access a few decades ago when I was a kid, I printed soldermask and legend inks on circuit boards. Printing solder mask, (PC-401, SR1000, LPI) I would use SM-1000 stencil material on 86 or 110 mesh I've been trying to find sm-1000 bu
Electronics Forum | Tue Aug 01 08:52:53 EDT 2006 | davef
We never changed any thing after moving to imm silver. "Poor release" (paste hanging-up in the stencil holes) could have three main (or combination of) causes: 1 Equipment * Proper aperture area ratio provide better release * Laser cut release bette
Electronics Forum | Mon Jan 09 19:55:32 EST 2006 | davef
"Poor release" (paste hanging-up in the stencil holes) could have three main (or combination of) causes: 1 Equipment * Proper aperture area ratio provide better release * Laser cut release better than chemical etched stencil 2 Process * Snap-off dis
Electronics Forum | Thu Jan 10 22:55:24 EST 2002 | davef
You are sure taking you sweet time getting this thing running. You're getting too much beach time. NOZZLE SELECTION Typically, the only rule of thumb that applies to choosing the correct nozzle ID is that it should be one half of the required dot d
Electronics Forum | Wed Oct 15 16:34:36 EDT 2008 | gregcr
Hi All, I am retrofitting a machine with a solder paste dispenser head, and am trying to decide what direction to go, with a dispense valve. The choices I know are either a standard Air over, or some kind of positive displacement valve such as a sc
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