Electronics Forum | Wed Apr 07 11:42:16 EDT 1999 | Tony A
| Tony | | Although I agree in principle with Dean that 45 Degrees would be ideal, most of the squeegees I have worked with have been 60 Degrees to the stencil surface. This seems to work best with metal squeegees when printing HASL boards, because
Electronics Forum | Thu Aug 19 11:58:12 EDT 2010 | davef
From "Universal Instruments Packaging Specification" ... [snip] Packing Of Populated Boards · These parts require individual separation and protection to prevent electro static discharge and structural damage. They shall be packed in sealed, anti-st
Electronics Forum | Fri Apr 23 17:44:50 EDT 1999 | Stefan Witte
| Hey Ya'll! | | Have any of you ever worked with one of V-Tek's "Economax" tape and reel machines? The biggest thing I'm curious about is the type of cover tape that these machines use. It's something they call P.S.A. (Pressure Sensitive Adhesive)c
Electronics Forum | Thu Jun 17 06:04:48 EDT 1999 | Ron G. Belliard, EET
RE: Cracked Capacitors: I have worked for 3 1/2 yrs with SMTA and have found a similar problem with capacitors. Throughout my studies of the problem, I have discovered three contributing factors that caused this cracking either individually or in co
Electronics Forum | Sat May 29 22:20:56 EDT 1999 | Earl Moon
| | Is it possible to place parts that do not have leadframes exposed when looking from the top side of the part such as BGA's using a Fuji IP1 with a SMD1 vision (Binary) system. I realize that the IP1 does not have front lighting but according to a
Electronics Forum | Fri May 31 17:04:02 EDT 2002 | davef
We use boots / shunts er wutt ever you call them to protect solderable component surfaces from wave soldering. Not sure how it would work in your case try: * Kinnarney Rubber 450 Main St. P.O.Box 37 Mantua, N.J. 08051 609-468-1320 fax 7438 http://ww
Electronics Forum | Mon Sep 17 15:27:51 EDT 2001 | jschake
Challenges: The basic defects that impact assembly yield are bridging, satellite solder balls, and opens (i.e. tombstones / draw bridges). There are many variables with the stencil printing process that can impact these; several of them are listed
Electronics Forum | Sun May 30 11:43:23 EDT 1999 | M Cox
| | | Is it possible to place parts that do not have leadframes exposed when looking from the top side of the part such as BGA's using a Fuji IP1 with a SMD1 vision (Binary) system. I realize that the IP1 does not have front lighting but according to
Electronics Forum | Fri Jul 09 18:36:48 EDT 2010 | rway
We don't use flex pcbs but have the same issue here. Most of our pcbs are HASL finish. I have looked at silver and gold immersion and both look really good under my color camera on my AOI. However, gold is more pricey. There is no additional cost
Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef
Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c
