Electronics Forum: second reflow baking (Page 7 of 115)

double side reflow soldering

Electronics Forum | Wed May 08 09:40:33 EDT 2002 | Hussman69

One thing most over look is the time between the last reflow and the second print. You don't want to print on a hot board.

Re: Double sided reflow

Electronics Forum | Wed Feb 18 12:08:04 EST 1998 | Eyal Epstein

Hi, I am from Celtronix Ltd. we are a provider of Odd Form assembly equipment and have gained a lot of experience in double side reflow, both the chemical side of it as well as the automatic insertion of all types of TH components in paste. Enclosed

Re: double sided reflow

Electronics Forum | Thu Jun 22 14:04:03 EDT 2000 | John Thorup

Hi Jason - I'll second (third?) everything said. Wassink's bible is available in the US from the SMTA bookstore with free shipping. It's pricey but worth every penny. 612/920-7682 www.smta.org jesse@smta.org John Thorup

reflow / soldering temperature

Electronics Forum | Thu Apr 05 12:27:12 EDT 2001 | davef

I concur with your second approach. A profile needs to be tailored to the design of the board, the components, and the solder paste. Your first approach seems to try to balance lower quality soldering with a lower process complexity.

DPAK drop @Second reflow

Electronics Forum | Wed Jun 15 10:30:18 EDT 2011 | SBecmpe

If you have the ability to control top and bottom zone temperatures verify that the difference in your peak area is 10 to 20 degrees. This will depend on the ovens capabilities.

Bare PCB reflow

Electronics Forum | Mon Sep 06 20:18:37 EDT 2004 | charly

hi, we are running high mixed low volume here, and i encounter many pcb delam after reflow issue. here some doubt need ur advise: 1. actually, what is max temperature and duration can a bare PCB reflow without any quality problem? if i allow bare

board delaminated after reflow

Electronics Forum | Wed Apr 08 11:33:51 EDT 2009 | 1036

2) STD FR4 material with HASL finish, 4 layer board. Reflowed under tin-lead temps with another 4 layer board same time(no delamination problem). 3) We uasualy do not pre-bake board unless board is too old. 4) We do not have the board on hand right

Re: Popcorn @ reflow

Electronics Forum | Thu May 20 19:11:48 EDT 1999 | Earl Moon

| | hello...can somebody help me regarding the POPCORN at Reflow. What is this POPCORN at reflow, what it looks like, its cause and corrective action if there is... | | | | your help is greatly appreciated...thanks | | | | omat marasigan | | | Deo

Re: double reflow

Electronics Forum | Thu Feb 11 09:59:49 EST 1999 | Dave f

| I would like to have information about the processability of different packages. | In particular I would like to known for which package I can use a double reflow for soldering. | | Best Regards | | | Michele: Double sided reflow is common pra

Part drop after reflow

Electronics Forum | Fri Jun 26 14:27:51 EDT 2020 | victorzubashev

Hi Indhu, It could be multiple reasons but probably one root cause. metal nut might require reflow profile change- you need to check it with SMT reflow profiler. the part might be oxidized - you can check solderability or try to solder part using a


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