Electronics Forum | Thu Jun 22 11:02:13 EDT 2000 | Chrys Shea
Jason, Double sided reflow should be no problem. People have been doing it for years. The surface tension of the molten solder will hold the components on the bottom side during your second pass. This is almost always the case, unless you have re
Electronics Forum | Fri Dec 08 19:09:44 EST 2006 | darby
I have just started production run using this component. After reflow I see that there is an undercut of solder between the pcb and the lead instead of a fillet. This means that some of the leads are sitting above the solder with no wetting to the co
Electronics Forum | Mon Oct 12 10:26:52 EDT 2015 | eniac
My greetings to all. Time to time I receive the next results of modems soldering: http://i.piccy.info/i9/71ae4c358c6e4bc3f1cbf140495bc437/1444660170/135005/872954/GL868_7.jpg or http://i.piccy.info/i9/d1181be142e285a39b49b81d37bde72a/1444660270/1
Electronics Forum | Thu May 20 15:07:12 EDT 1999 | JohnW
Earl, your colourful impressive descrptions are a joy to read..well lighten's up my day but maybe it's just me...ummmm..? anyhoo, Omat, as Earl has said ..this is a moisture sensative problem basically the reason you blow the shit out of the compon
Electronics Forum | Sat May 22 19:38:59 EDT 1999 | Omat Marasigan
| Earl, | | your colourful impressive descrptions are a joy to read..well lighten's up my day but maybe it's just me...ummmm..? | | anyhoo, Omat, as Earl has said ..this is a moisture sensative problem basically the reason you blow the shit out of
Electronics Forum | Fri Aug 17 08:37:47 EDT 2001 | jbieber
Gregory, I think that the profile is too radical, i.e. zone 6 to zone 7 temperatures are too far apart. I would guess that the solderjoints have not all reached 183C in zone 6 which is why the uBGA's do not have a symmetrical ball collapse. You may
Electronics Forum | Tue Jul 18 09:57:17 EDT 2006 | slthomas
You might try baking the boards before using them. If the problem goes away you might want to look at what sort of environmental controls your board fab guys are using/stuck with/wishing they had.
Electronics Forum | Tue Feb 13 15:56:16 EST 2007 | darby
Campos, This is a direct reply I recieved from Indium, (thanks to Rich Brooks), in late 2004 regarding SMQ230. I have followed these guidelines with good results using ENIG finish. Same also applies to Indium 5.1 apply to both alloys (SAC 387 and 305
Electronics Forum | Wed Aug 23 09:16:42 EDT 2000 | Dave F
Dr. Lee: How do the metallurgical properties of solder change during a second reflow. Please provide detail on this phenomenon.
Electronics Forum | Tue Jun 28 10:41:57 EDT 2005 | GS
I am not an expert but just for my understanding: - solder paste used ? NC ? other ? - reflow in Air or N2 ? - temp ramp up before soack (�C/second) ? Tnks GS
