Electronics Forum | Sat Sep 29 08:12:06 EDT 2001 | roland
Gregory, Thank you for posting the results of running your boards yesterday (glad to hear everything worked out well). I am sure other SMTneters are glad to see the sharing of their information helped. Perhaps others who have used information pr
Electronics Forum | Tue Aug 07 20:51:43 EDT 2001 | davef
Sowaza BIC? Ru the ball point pen people? Know no sites, like thet, but let�s see what we can do here. Wedabomb. First, rather than defining the controls your suppliers must use to produce your product, why not specify a DPMO rate er suppin like t
Electronics Forum | Fri Aug 10 15:30:38 EDT 2001 | davef
More and more pople are seeing voids in solder connections other than BGA balls than ever before. Thats because they never looked [never had the means to look] before. Now, they can't stand it and, like that zit that their mother told them not to m
Electronics Forum | Wed Aug 15 16:57:42 EDT 2001 | jfure
Hi; I see that most threads are related to professional activities, this question is related to my new hobby. I am putting together an audio amplifier based on a national SMT IC (LM3886, TO-220 11 pin package) with pin pitch of 1.702mm. How can I f
Electronics Forum | Mon Aug 27 16:22:22 EDT 2001 | seand
Hello Everyone, This is the core application for the 3800. I have a number of customers with these systems that are extremely happy with them in my territory. If you contact your local Speedline-Camalot Representative, they should be able to get y
Electronics Forum | Thu Aug 30 13:22:47 EDT 2001 | arzu
180deg More important are the preheat and soakzones and temp ramps. How to check: I used to do it as follows: use a TEST-PCB with fixed thermocouples and connect it to the mole. Print the profile on transparant paper. do it again e.g. each week and
Electronics Forum | Sat Oct 06 08:36:04 EDT 2001 | davef
Your point about thermosets getting soft in the preheater of the wave is well taken. But an adhesive that is used past its expiry or other up-front lack of process control represent 99 & 44/100 percent of the reason for �glued parts falling off in
Electronics Forum | Mon Oct 08 20:58:35 EDT 2001 | ericchua
Look like no way you can measure after glue printing. We have been running glue printing for about 2 years and using the "push test" method for testing the strength of connection of component and board. I don't see any problem. For component ( 0603 &
Electronics Forum | Fri Aug 31 10:26:20 EDT 2001 | jacob
I recently purchased some magnifiers without doing much research at all and now I realize I should have come here first. The units we bought have a round lens and people are complaining that they can see in the middle of the ring but their vision get
Electronics Forum | Sun Sep 09 14:34:50 EDT 2001 | darburch
Eric Whenever I see a board come out of the chipshooter missing parts the first thing to check is the support pins. However if you have checked table and part height I assume that you have also checked the pins. So the next thing to check is the vac
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