Electronics Forum | Wed Sep 12 21:16:23 EDT 2001 | raton
The quip; All you can get! By the way, worthy answers above, especially Dave F getting a little tied up is good to see, he's always on the money otherwise. But seriously, watch for damage to other components. Example; thru hole's such as radial c
Electronics Forum | Thu Sep 20 11:22:13 EDT 2001 | ert002
Sorry for not getting back sooner.. a virus attacked our network yesterday. The experiment you have outlined is what I had next on my list...just trying to see if anyone had done it before. We will be experimenting with 0.004" and 0.005" thick sten
Electronics Forum | Fri Sep 21 10:44:34 EDT 2001 | slthomas
You can, and for small parts you probably won't see much difference between body temp. and lead temp. For QFPs or PLCCs there will be a much greater delta, though. I'd be more concerned with the small surface area you're making contact on (spherica
Electronics Forum | Mon Oct 22 17:47:47 EDT 2001 | davef
We on SMTnet have danced around this component package, but there is not a "background" of knowledge in the fine SMTnet Archives. We in our company use this component package, but have not seen the problems you discuss. [We see other problems.] Th
Electronics Forum | Thu Oct 25 04:52:17 EDT 2001 | Vai
I'm running intrusive reflow. What happened was when the board went thru' the first reflow ( which is secondary side ), at Post reflow, I can see the solder joint quality is very good smooth and shiny. But when we proceed with the 2nd reflow, at Post
Electronics Forum | Thu Nov 01 04:32:52 EST 2001 | wbu
Jonathan, we do that all day. We do not use different pastes nor do we glue components nor do we run different profiles. Depends on what is meant by "small components". In our case it�s all that "bird seed" up to SO8. That will work for more parts.
Electronics Forum | Mon Nov 05 04:59:59 EST 2001 | madreindeer
hi, I have found dull joint when I have done trial if boards and cooling too fast.Also with Nitrogen.Some of paste don�t like Nitrogen too much. Also I have seen this when profile is not hot enough or flux haven�t survived to liquidus point. I wou
Electronics Forum | Mon Sep 16 20:26:29 EDT 2002 | davef
Oftimes when I see aggrandizing self-promotional postings like this, I ask Brian at SMTnet.com to: * Delete the posting, explaining why I consider the posting to be inappropriate. * Contact the offending poster and explain proper decorum on SMTnet.co
Electronics Forum | Tue Sep 17 16:14:51 EDT 2002 | bdoyle
Sheriff Doyle reporting for duty. Yes definitely send these type of things to me. That's one of my [many] jobs. Off hand note, I was asked to remove one of the posts here because it wasn't coming out correctly (the internet is like that sometimes)
Electronics Forum | Thu Nov 15 13:46:28 EST 2001 | Terry Burnette
Underfilling PBGA's will increase the PCB level solder joint life by 4x-5x but we only recommend underfill for products going into extreme environments. Normally the 272ld and 388ld PBGA's solder joints when cycled at -40C to +125C should not see any
