Electronics Forum | Wed Nov 06 17:50:46 EST 2002 | davef
I hear you on the profiling issue. That won't get at the issue any how. Your observation of solder wetting confirms that solderability is NOT the issue. You may be seeing a "cold solder connection". The issue is the TCE of the different materia
Electronics Forum | Thu Nov 07 07:53:27 EST 2002 | cyber_wolf
Dr. Ning Cheng Lee from Indium Corp. of America has written papers on this phenomenon.Perhaps they would be willing to assist you. I am pretty sure I know exactly what you are talking about. We see this as well.Does it kinda resemble a disturbed sol
Electronics Forum | Wed Nov 20 16:27:15 EST 2002 | pjc
FYI: MPM does in fact offer alternate board support tooling than the vacuum box system. They have the X and Y snugger tooling, which clamps the board and uses magnetic support pins. If you are looking at a used UP2000, check to see what tooling it ha
Electronics Forum | Mon Nov 11 10:29:37 EST 2002 | Yannick
Hi, I'm beginnig working with BGA and with test I made I see some Void in it. I know that IPc have something on it. But I would appreciate if someone who have a good knowkledge about it contact me at: yb@m2s.ca Or can you give me some hint t
Electronics Forum | Thu May 08 21:04:43 EDT 2003 | davef
It may seem like a year, but this has been going on for closer to six months. Oh, it's because the administrators at SMTnet think is soooo valuable to us that sales-types have an opportunity to dredge-up and open ancient threads for their self-promo
Electronics Forum | Fri Nov 22 15:59:43 EST 2002 | GSW
What type of reflow profile are you using ? There is a void reduction profile recommeded by some paste manufacturers, Try that it might help. Did you check the components or the board and see if they have absorbed mositure ? try baking the boards and
Electronics Forum | Sat Nov 23 10:19:39 EST 2002 | davef
This sounds alot like the warping that we all see periodically in BGA. CTE of material is temperature dependent and not temperature changing rate dependent, so you are pretty much hosed by the physics. Regardless, I do like trying like crazy to g
Electronics Forum | Mon Dec 02 16:19:11 EST 2002 | slthomas
Unfortunately it's nc or we'd be worrying about this on the fly. Non-contact is defintely and issue....this is an 18"x9" board with 1500 bottom side SMT parts that are scattered among the through-hole and vice-versa. We're currently using 7 hold-
Electronics Forum | Tue Dec 17 13:42:04 EST 2002 | robf
There are a few emerging technologies that have been growing in popularity for the past few years. Pin through paste, press fit connectors and selective soldering machines seem to be displacing custom fixtures. Most of the mixed technology boards o
Electronics Forum | Mon Dec 02 16:25:06 EST 2002 | jimlew
In doing process qualifications for 0201 caps, has anyone taken cross-sections and discovered cracks / hairline fractures / voids between the metalization on the end and the ceramic itself? (not cracks in the solder joint) We are well within the cap
