Electronics Forum | Mon Aug 24 04:46:54 EDT 2009 | joannetjy
Hi Radek, Thanks for your reply. I use this flux with manual soldering process for the product. Is this flux suitable for manual soldering? or it is only for wave soldering? I have sent the board for analysis, and the report shown that the white res
Electronics Forum | Thu Jul 06 04:41:58 EDT 2006 | Rob
MF300S is quite an old flux, & a lot has happened since then on the flow solder front - are you sure it's designed for Lead free, or is it just a traditional flux that SHOULD work OK with Lead free?
Electronics Forum | Tue Jan 19 10:18:58 EST 2021 | grahamcooper22
Hi, try a low spitting cored wire...something like ALMIT SR-LA cored wire...or SR-LA SUPER...it eliminates flux/solder spitting during soldering.
Electronics Forum | Mon Jan 15 11:41:56 EST 2007 | davef
Questions are: * Does the component take solder when you dip it in the solder pot to test the solderability of the leads? * Can you get full barrel fill when wave soldering a bare board? * Is your flux reaching the top of the board through the hole b
Electronics Forum | Tue Apr 10 04:16:20 EDT 2012 | grahamcooper22
you are seeing a typical issue that is caused when such small volumes of paste are printed....there are several reasons for it..the tiny amount of flux in the small deposit becomes exhausted much quicker then it does in a larger deposit ( the flux ma
Electronics Forum | Wed Dec 09 18:51:06 EST 2020 | johndep7
My company has been having issues with a lot of solder balls, solder splash, and flux balls all over a specific board. Now this is one of the only companies that require us not to clean our boards after our work is finished but this is also causing a
Electronics Forum | Wed Jul 05 10:13:02 EDT 2006 | jdengler
Is the flux rated for lead free? These higher temps will cause most lead rated fluxes to burn off prior to the wave. Jerry
Electronics Forum | Mon Jul 10 07:46:51 EDT 2006 | ronalds
You are right, RSS profile is not the correct description. I am using a profile which heats up quickly to let the flux spread. Next linear up to activate the flux and prevent thermoshock. My experience is however, that small changes in this profile
Electronics Forum | Fri Aug 27 10:25:52 EDT 1999 | Matthew Park
Is it feasible to have one type of board carriers to take boards thru 1) glue curing process for first side and 2)invert carriers with boards, and 3)reflowing second side, and 4) do manual stuffing of th components and 5) take them thru selective wav
Electronics Forum | Fri Apr 06 08:45:48 EDT 2007 | davef
UNDERFILL The design of the component and the end-use environment drive the requirement fot underfill. Here is a good introduction: http://www.asymtek.com/news/articles/2002_globaltronics_csp_and_fcuf.pdf Google for more. We have no relationship, n
