Electronics Forum | Mon Jul 17 11:40:20 EDT 2006 | Chunks
It's been a few years, but lack of preheat was my problem with this machine.
Electronics Forum | Fri Dec 07 02:53:26 EST 2012 | beta
no expert but would using a smaller diameter nozzle help in anyway?
Electronics Forum | Fri Dec 07 02:55:24 EST 2012 | aj
I am no expert but would using a smaller nozzle help in anyway?
Electronics Forum | Wed Dec 12 16:16:39 EST 2012 | tombstonesmt
Nitrogen at nozzle supply is at around 47.5cfh.
Electronics Forum | Tue Dec 11 11:59:00 EST 2012 | sarason
The issue is surface tension around the connector. Your tip needs to have more surface tension than the pins of the connector as it forms a cluster when being soldered. When I used to solder superfine connectors with a metcal iron it had a horses hoa
Electronics Forum | Thu Jul 13 13:51:13 EDT 2006 | George
I got some info about it last year. I could not justify ROI since this machine was way too expensive (same thing with Vitronics Selective machines). You need to see if this machine will increase your throughput or not depending on your products. Al
Electronics Forum | Fri Jul 16 04:30:29 EDT 1999 | Luca
I'm planning to introduce selective point-to-point soldering for pwb. This is due to various needs: PIHs assy on double IR, for example. I think the most suitable solution is a point-to-point soldering, 'cause we're still having small lot/many type p
Electronics Forum | Mon Sep 24 18:03:43 EDT 2012 | rmazenha
Hi, i am using AIM 264-5 No Clean flux for soldering alpaca pieces on PCB boads, but i am having problems: poor filling and no solder. I am using SAC 305 lead free solder. I have tried to change flux pressure, time, ammount as well solder speed an
Electronics Forum | Mon Mar 17 04:31:52 EDT 2008 | d0min0
Hello, tried searching the SMTnet archives, but not yet a clear answer - maybe there is not a one yet ? ;) last discussion I found is few years old so maybe there is a fresh view on that? Q: we want to prove that our proces is "clean" we use SAC30
Electronics Forum | Mon Apr 18 12:39:57 EDT 2022 | winston_one
Thanks for all comments. Process was adjusted normally, problem was in PCBs. Microsection of bare boards confirm that the copper thickness in troughholes was unsuffient, sometimes below 10 microns, on soldered boards where there were a problems durin
