Electronics Forum | Wed Mar 19 04:15:03 EDT 2008 | d0min0
Thank You Michael, as I read on previous contamination related topics I planned to ask your opinion on that directly :-) but You were faster than my action :) I will share Your opinion internally and hopefully we will take further actions best reg
Electronics Forum | Mon Dec 10 13:26:40 EST 2012 | dyoungquist
We are using our selective solder machine to solder a backplane with sixteen (16) 4x48 pin 0.080" connectors. Our first pass yield is about 85% meaning that 85% of the connectors come out with no bridges. Not quite as fine pitch as your connector a
Electronics Forum | Tue Sep 25 19:26:39 EDT 2012 | caurbach
So, I just learned that alpaca isn't just a cousin of the llama, it's also a Cu/Ni alloy (imitation silver). Creeped me out at first... When you say "poor filling and no solder", are you referring to wetting problems? Do you have any photos you co
Electronics Forum | Wed Dec 19 10:33:58 EST 2012 | emeto
I had a connector like this and here is my recommendation: 1. Flux type(I like better alchohol based flux than water based) 2. Try higher soldering speed(when I say higher I mean several times higher) Goodf Luuck!
Electronics Forum | Thu Apr 14 15:27:05 EDT 2022 | ppcbs
If it was ROHS I would suspect copper migration. In my experience an acceptable copper finish should last up to at least 6 reflow cycles. If you have bubbles or blow holes in the solder joint, that is a sign of voids in the walls of the copper barre
Electronics Forum | Fri Dec 07 13:31:09 EST 2012 | kenkay
We had a similar issue and it was fixed by trimming the connector so there was barely enough lead protrusion through the board to show a discernible lead. We had to get a special plate and small machine to cut the connectors, but we haven’t had a bri
Electronics Forum | Fri Apr 15 09:56:17 EDT 2022 | winston_one
Thank's Dennis. I'm also now think in this direction. Process was adjusted and soldering are good. But one from five boards can have this effect with bubbles and strange uneven distribution of solder inside the barrel. Probably copper is too thin and
Electronics Forum | Wed Apr 13 21:17:18 EDT 2022 | stephendo
If it was ROHS, I would say that the pads are definitely dissolved away. And it sounds like that is the case here. Your best bet is if it is class 2 and the barrels are at least 50% then push for them to be accepted. If you are trying for more barr
Electronics Forum | Thu Apr 14 14:00:44 EDT 2022 | winston_one
Also at few boards we see excessive voiding, extremily excessive. During solderind some bubbling can be observed near the soldering point. Boards was dried before assembly. May be we have a problem with too thin metallisation - that's why poor adhesi
Electronics Forum | Mon Apr 18 12:14:39 EDT 2022 | proceng1
As far as hole fill, as was stated above, class 2 only requires 50% up-fill. In order to get better up-fill on the initial pass, you may need to consider more pre-heat. Also, better application of flux. Are you using a drop jet, or a spray? You
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