Electronics Forum | Thu Oct 02 15:34:08 EDT 2014 | arifa_anees
the data collected from a standard SMT process is typically very noisy due to the natural.Initially, the most common evaluation method was placement yield.Offset Placement After Solder Screen-printing can reduce or eliminate these defects through cor
Electronics Forum | Thu May 14 12:29:39 EDT 2015 | christinapaz
Hi All, On occasion we see components that have gone through pick and place and are slightly misaligned. Currently, operators manually adjust these misaligned components to prevent reflow failures. However, I am wondering if this readjustment may be
Electronics Forum | Mon Dec 27 19:10:58 EST 2021 | ppcbs
The component should float into place provided you have the correct amount of solder paste. Perform a solderability test on the pads. We have come across new components with oxidation that prevents wetting. This will cause components to not self ali
Electronics Forum | Mon Apr 23 11:31:23 EDT 2001 | Cal
You may have answered your own question. If SSD is the end all save all there would be more people using this technology. I view SSD as an option to have flat planar pads. I also know the price per Board is more then "standard" boards. The sample b
Electronics Forum | Thu Jun 29 08:41:24 EDT 2006 | russ
I agree that a BGA may be the better/easier process overall, but it is not 3 dollars per assy better, I am in agreement that you should be able to handle QFPS just as well as a BGA. PBfree BGAs do not self align BTW, so one needs to keep that in mi
Electronics Forum | Fri May 15 00:07:38 EDT 2015 | aapsmt
there can be so many different causes. can be component library height issues. step program z axis offsets - i have seen accidental positive values entered so the components are literally dropped onto the pcb haha. but it does depend on the size of
Electronics Forum | Wed Aug 22 10:57:59 EDT 2001 | wbu
Hi Steven, BGA�s are known for their ability to self align and from own experiance they do. There�s enough documentation on this one available (...don�t have the links present like Dave but I�m sure he will give you enough to spend some evenings rea
Electronics Forum | Sat Jun 04 12:11:49 EDT 2011 | davef
Q1) How to identify on good or bad RF shield that could contribute to dewetting? A1) We use Alloy 770 and 752 [German silver] for our RF shields. We have never seen a solderability issue, even aged stock solders well. * Nickel Alloy 752, Nickel Silv
Electronics Forum | Thu Feb 05 02:34:05 EST 2009 | sachu_70
Hi Manuel, most passives are chip components. These tend to self-center/align during the reflow process. However, you need to ensure that there is a uniform balanced solder paste deposit. I had tried few such ovals in earlier stencil designs and resu
Electronics Forum | Fri Oct 16 21:07:31 EDT 1998 | Scott McKee
| I need the following information on uBGA's - body size, ball pitch and ball diameter. Are they a plastic package (with the resulting moisture sensitivity of a PBGA)? Also, does the uBGA put any special requirements on pick and place equipment? |
