Electronics Forum | Thu Feb 05 02:34:05 EST 2009 | sachu_70
Hi Manuel, most passives are chip components. These tend to self-center/align during the reflow process. However, you need to ensure that there is a uniform balanced solder paste deposit. I had tried few such ovals in earlier stencil designs and resu
Electronics Forum | Fri Oct 16 21:07:31 EDT 1998 | Scott McKee
| I need the following information on uBGA's - body size, ball pitch and ball diameter. Are they a plastic package (with the resulting moisture sensitivity of a PBGA)? Also, does the uBGA put any special requirements on pick and place equipment? |
Electronics Forum | Thu Jun 13 21:44:21 EDT 2002 | jkhiew
Hi all, * Defect : termial to terminal touching btw two melfs body that created short circuit. * Clearance : 0.8mm btw two melfs body. * Size melf : diameter=2.4mm to 2.7mm, length=4.8mm to 5.2mm * Stencil opening : "v" shaped to minimise component
Electronics Forum | Mon Jan 23 21:56:50 EST 2017 | jgo
Hi all, Am new to the SMT process. I'm in the process of purchasing a new SMT Pick & Place machine and am trying to figure out how to perform the buy-off. I'm from the semiconductor packaging background. For any new machine purchase, I'm used to se
Electronics Forum | Tue Jun 02 08:30:30 EDT 1998 | Jon Medernach
I have to agree with Steve. If the problem is progessively worse the problem is the pitch conversion that was used, and I have seen it before. It may be masked by the solder paste which could be on pitch but after reflow the paste wickes to the pad
Electronics Forum | Thu Aug 26 14:45:09 EDT 1999 | Earl Moon
| What are the key steps to achieving high yield with CSP ??? | | (We are trying qualify vendors for volume fab/assembly of some | products which use several CSP devices on each side of the | board. (Some with 0.5mm ball pitch)) | | Looking throu
Electronics Forum | Mon Jun 01 17:41:59 EDT 1998 | Jim Hoxie
First of all let me say that we are currently placing other 240 pin QFP'S with no problem. But none of them have the MASS of this beast. The part is a XILINX XC5215-6HQ240C which has a large metal heat sink covering most of the bottom of the part. T
Electronics Forum | Tue Jun 02 16:02:13 EDT 1998 | Earl Moon
| First of all let me say that we are currently placing other 240 pin QFP'S with no problem. But none of them have the MASS of this beast. | The part is a XILINX XC5215-6HQ240C which has a large metal heat sink covering most of the bottom of the part
Electronics Forum | Mon Sep 24 17:38:18 EDT 2001 | mparker
First question - do you have a rework station? If so, are you experiencing the same type of failures there? I have successfully used no-clean on uBGA's in the past. 6 mil solder bumps, 10 mil spacing. 88 sites. Are you reusing previously soldered uB
Electronics Forum | Sun May 31 11:14:48 EDT 2015 | visionbot
Looks good. Have you done any work on feeding > form part tubes? I have a back burner project > trying to speed up the changover on our machine > with the vibe feeders. VisionBot works with cut tape SMT, is not necessary to have advanced mechani
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