Electronics Forum | Wed Jan 01 22:19:33 EST 2020 | sssamw
Solder ball attached on solder joint without violation minimum electrical clearance is acceptable. If your process parameter including stencil not changed, suggest you check if solder pasted being pushed out after IC placement, also check if solder j
Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef
Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c
Electronics Forum | Tue Sep 22 13:14:27 EDT 1998 | Chrys
| We are getting into a lot of double sided boards offlate. Our customer is loading a lot of RNETS, Diodes ( MINLS, SOT23s and other 2 leaded diodes ). We are processing it through a traditional glue process and wave soldering the SMT parts along wit
Electronics Forum | Fri Apr 22 14:28:38 EDT 2005 | Gary Goldberg - PROMATION
Low end selective laser soldering systems are limited to what types of soldering can be performed. I have read through the previous comments and find that most have commented on earlier technologies (which do not offer the features today's system do)
Electronics Forum | Wed Feb 12 13:37:22 EST 2003 | dwanzek
I need some input on what good solder thieves dimensions should be. I am limited to solving my bridging problem with solder thieves; all process/wave variables have been adjusted to try to solve this problem. There are several of these connectors on
Electronics Forum | Thu Jan 15 15:13:50 EST 1998 | justin medernach
| I have a problem! The solder on my pc boards look great comeing out | of my reflow oven. They go thrue the rest of the prossese | and at the end at the qc station it's cold or whitish or gray not shiny. | does any one have a idea on how to correct
Electronics Forum | Mon May 24 09:52:06 EDT 1999 | john thorup
| | | Has anyone had any experience or data using vibration during the reflow process. | | | We introduced a vibration device attached to the fixed rail on a Vitronics reflow oven. The reason was to prevent skewing on large PLCC devices. The process
Electronics Forum | Sat Jan 16 03:06:36 EST 1999 | Wirat S.
| | Our spec on voids is 30% ball diameter in the center. On the component to ball and pad to ball interface, we use 25%. To determine this spec, we asked around. I don't know of any studies that have been done to verify if this is OK | | | | Regard
Electronics Forum | Mon May 14 16:36:58 EDT 2012 | davef
You're thinking correctly in trying to improve your process. Can you change to a more active flux? Look at the copper that connects to the center pin. You may need to relay-out the board to add a wagon wheel style thermal relief in that area.
Electronics Forum | Mon May 14 12:44:08 EDT 2012 | tomgervascio
I am a user of an Ersa Versaflow 3/45. I was wondering if anyone could share some process pointers. I have a 0.125" multilayer PCB that I am having problems consistently achieving 75 percent hole fill on a mini-coax connector. The coax connector ha
