Electronics Forum | Mon Feb 12 02:17:32 EST 2007 | Wayne
Most of the semi-con is using SAC305 balls. Only the PCB assembly house feels the heat, but semi-con never feels any pressure.
Electronics Forum | Mon Feb 12 01:09:49 EST 2007 | Wayne
I think the best way is to the following: - to use the low temp solder paste, or - asks semi-con use low temp solder sphere to make BGA
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