Electronics Forum | Mon Dec 18 01:25:47 EST 2006 | seety1981
test engineer and product engineer... Hi all, Sorry if this topic is not suitable to be in this forum.. anyway,... i would like to know what the different of the jobs scope between the Test Process and Test Product engineer in semiconductor manufac
Electronics Forum | Thu Aug 02 21:22:15 EDT 2018 | davef
I need your input. What are your thoughts? Currently SMTnet is looking to improve process. It uses four different lists of categories that all are maintained and updated separately. A single LIST makes sense. Approaches to arranging the LIST being
Electronics Forum | Wed Jun 23 13:56:56 EDT 1999 | Stan Frul
Hi Could anyone tell me where i can find information, in the literature or on the Web, concerning measurements of temperature distribution, expansion, stresses in the substrate and heat sink and on the interface between them, that is all the range of
Electronics Forum | Tue Nov 06 10:24:30 EST 2018 | davef
Standards Organisations, Electronics Technology & Manufacturing: • International Printed Circuits (IPC) • Semiconductor Materials & Equipment International (SEMI) • International Electrotechnical Commission (IECQ-CECC) • British Standards Institute (
Electronics Forum | Thu Jun 24 11:29:50 EDT 1999 | Matt Stump
| Hi | Could anyone tell me where i can find information, in the literature or on the Web, concerning measurements of temperature distribution, expansion, stresses in the substrate and heat sink and on the interface between them, that is all the rang
Electronics Forum | Wed Oct 10 17:56:35 EDT 2001 | seand
Hello all, My respone here is to add options for evaluation for the engineer. Not to convey that they are the only options as that would be reckless. Cyberoptics does have a standard line of machines configured for in line paste inspection. Some
Electronics Forum | Fri Apr 12 17:10:41 EDT 2002 | davef
Consider: * Finding JEDEC [ http://www.eia.org/jedec/ ] publication that includes matrix trays is: �JEDEC Publication No.95 Registered and Standard Outlines for Solid State and Related Products�. * Contacting tray manufacturers [ie, Peak, Summit, Nep
Electronics Forum | Wed Sep 29 04:33:35 EDT 1999 | Earl Moon
| | Hi All, | | Any one experince BGA-chipset warp about 10-15mil after removing | | from PCB? | | FYI, the rework temperature for preheat was 170C from room | | temperature about 30 seconds, & BGA was removed at temperature | | between 190-200C.
Electronics Forum | Sun Oct 07 07:34:25 EDT 2001 | davef
No one wants to be limited to one alternative in evaluating such equipment. Who would you suggest as viable alternatives to: * Cyber Optics in evaluating alternate suppliers for inspection equipment? * Royce Instruments in evaluating alternate sup
Electronics Forum | Mon Sep 11 10:35:32 EDT 2006 | Gus Widmayer
Hi Dexter, Your problem may not be with the feeder itself but with the quality of the tape you are receiving. OX3 Corporation performs a peel test on every single line item that is processed through its facility. You may want to check with your cu
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