Electronics Forum | Wed Nov 08 08:12:16 EST 2006 | jnaligan
hi... try evaluating eco solder paste Sn96.5/Ag3.0/Cu0.5 from Senju... output is good and i suggest your stencil's apperture ratio with the pad 1:1 when it comes to fine pitches...and BGA pads regards, janry
Electronics Forum | Thu Apr 29 17:35:17 EDT 2004 | Shinmoto
Hi there, We place FBGA packages on a lot of our memory modules. Our stencils have .013" square apertures and a .005" foil thickness. We are using a type 4 paste from Senju Comtek. The price difference is not that significant and readily available
Electronics Forum | Fri Feb 29 09:56:34 EST 2008 | iantech
Hi all are any of you guys using Dek proflow catriges with senju paste, Just wondering what the temp should be for transport and storage ian
Electronics Forum | Tue Jun 20 06:39:02 EDT 2006 | Julien VITTU (STMicro)
I'm using a lead free solder paste, low residue from SENJu among all the pastes I've tried it is the best I've found. you can ask for any type of alloy, but request the 729C flux type. kind regards
Electronics Forum | Tue Apr 26 05:04:10 EDT 2005 | siverts
Sorry for my blackout, but here it comes: Solder paste: Senju 7100-GRN360-K1MK-VS Sn 95.5 Ag 3.9 Cu 0.6 Solder wire: Kester 24-7040-8834 Sn 96.5 Ag3.5 Regards,
Electronics Forum | Sat Nov 10 23:46:36 EST 2007 | mika
BTW, The surrounded QFN fine pitch terminals should have the normal aperture reduction of 7 % in case of RoHS Senju solder paste. This works for our Telecom customer. The vias in the ground pad will be somewhat filled with solder and makes it diffi
Electronics Forum | Fri Sep 11 00:56:44 EDT 2020 | rsatmech
Thanks for your inputs. Soak - 120 to 180 at average 110sec Paste - Senju - S70G - Type 5 (also suspect paste chemistry yet it's customer defined I can't do anything about this) N2 - maintaining O2 PPM at 1000 Stencil - planning to reduce the stenci
Electronics Forum | Thu Sep 23 11:56:30 EDT 2004 | rkevin
We are printing on an assembly using SAC305 Alloy Sn96.5 Ag 3 Cu .5 with a no clean flux and getting virtually NO spread with either a ramp to spike or straight ramp profile. We are printing to standard FR4 board with immersion Ag finish. I am trying
Electronics Forum | Wed Mar 02 09:19:33 EST 2005 | Indy
we use SENJU M705. type3 solder paste. Has a good shelf life.
Electronics Forum | Thu Dec 15 21:23:57 EST 2005 | davef
Welcome. A day and a half seems like a very long time to leave paste on your stencil. We'd expect that the volitiles in the flux would have left the building in that time, making the flux less active. We start with fresh paste at the beginning of
