Electronics Forum | Fri Sep 24 04:57:22 EDT 2004 | FengAng
So many people have concerns on the MSD(moisture sensitive device), but I want to know if anybody can SHARE me some information about the TSD(temperature sensitive device). And I think there are also a lot of knowledges need us to learn. In my opini
Electronics Forum | Fri Sep 24 11:08:13 EDT 2004 | davef
We're not sure what you mean by temperature sensitive components. From an assembly process stand-point, every component we use is temperature sensitive to one level or another. More specifically, some of our products use polyphenylene sulfide (PPS)
Electronics Forum | Wed Sep 23 10:42:13 EDT 2015 | ehess
is it necessary to vacuum seal moisture sensitive components? Or can we just seal with desiccant in proper bags?
Electronics Forum | Wed Nov 11 22:13:45 EST 2015 | jackzhong
Hi, if you seal in proper way, it is not necessarily to vacuum. we are specialized in moisture solution for electronics and components. Maybe we could give you some workable advice or solutions. If you are interested, contact me by Skype:dryplus1 o
Electronics Forum | Wed Sep 23 13:20:02 EDT 2015 | emeto
Depends on the MSL(Moisture sensitivity level) and how far you will use them in production. Here you should be able to get all the answers: http://www.jedec.org/sites/default/files/docs/jstd033b01.pdf
Electronics Forum | Tue Feb 20 15:39:31 EST 2001 | fmonette
To my knowledge, the 40C was established as the maximum "safe temperature" for all tape and reel packaging. The actual specs may vary somewhat for different types of reel, pocket-tape, cover-tape but you must be concerned with the cover tape adhesive
Electronics Forum | Wed Sep 23 14:30:05 EDT 2015 | deanm
"...air evacuation is not required (Figure 3-5). Light air evacuation may be used to reduce the packaging bulk and enhance carton packing (Figure 3-6). Full evacuation shall not be used as it will impede desiccant and HIC performance and possibly lea
Electronics Forum | Tue Feb 20 04:18:39 EST 2001 | chinaman
Hi everyone if once the exposure time is exceeded the only option is to bake the components. I learned there is an "old spec" for the baking conditions (24h/125C or 192h/40C) and a "new spec" which is the current standard specifying conditions of 4
Electronics Forum | Tue Feb 20 16:33:08 EST 2001 | davef
Time, time, time. There just never seems to be enough!!! Eh? You�re correct. Depending on the material, some trays can take a high temperature bake, while other trays, in addition to tubes, and reels, require a low temperature bake. With this la
Electronics Forum | Thu Dec 13 21:02:38 EST 2001 | davef
Contact the fabricator of this part for their recommendations. There is about as many different approaches to soldering thermistors as there is thermistors. You imply that this is a SMT style package. If that is correct, it's curious that the comp
