Electronics Forum: separation distance (Page 1 of 3)

MPM AP25, separation problems

Electronics Forum | Fri Oct 28 08:37:06 EDT 2005 | pavel_murtishev

Once again, it isn�t the process problem. It�s machine problem. I�ve tried to change all of the parameters: printing speed, printing pressure, snap-off speed, snap-off distance, etc. No any effect. Defect still exists with different process parameter

MPM AP25, separation problems

Electronics Forum | Wed Nov 02 01:53:41 EST 2005 | pavel_murtishev

Hello, Thank you for answer. We are using second hand machine. What do you mean saying that �stencil is not height on all 4 corners�? Does it have some inclination between corners? I mean that three corners of stencil are matching with PCB fine and

minimal distance between THT solder padsfor selective soldering

Electronics Forum | Wed Apr 18 15:10:10 EDT 2018 | charliedci

If someone can find a RoHS specific standard I would be interested. IPC-2221 nor 2222 separate leaded from lead free (that I could see). Charlie

The minimal distance btw component and the edge of pcb

Electronics Forum | Sat Nov 05 20:23:11 EDT 2016 | sarason

Close but not to close, would have to be the spec. Or depends on your separating technology. Prerouted boards on a panel, you could go right up to the edge. V-grove you will need more distance, maybe 2mm's or more. The distance from the panel edge to

V-scoring design and equipment questions

Electronics Forum | Mon Jun 12 13:10:05 EDT 2006 | muse95

Why do they say to specify the depth of the score, rather than the thickness of the web? How does the scoring equipment work? Is it two blades that you can set the separation distance? Or is it one blade, that you have to run the board through twic

Glue dispenser dor SMT line ( Glue process )

Electronics Forum | Tue Jun 19 08:35:24 EDT 2007 | pavel_murtishev

Dear Sami, Consider doing DOE it the printing speed is a point of concern. A few questions: 1. Which glue do you use? 2. What are the printing process parameters you have entered into your DEK? Could you list them here (front/rear printing speed, s

Pasteprinter | unffilled Pads

Electronics Forum | Mon Oct 16 18:51:14 EDT 2023 | alexv

It looks to me that you might have a poorly etched/polished stencil. Also, I would check separation speed and distance.

Glue

Electronics Forum | Mon Sep 21 22:25:05 EDT 2009 | davef

What babies!!!! Sure, give it a try. * Stencil material: metal or plastic, no difference in print, metal is easier to clean, no static problem, available * Stencil thickness: Chips 0.006", SOIC 0.010" [print height equals 1/3 thickness] * For 0603, a

printing speed - paste vs. glue

Electronics Forum | Fri Oct 09 06:32:38 EDT 2009 | davef

Here's what is on that post referred to, not sure what you need more than ... "* Stencil material: metal or plastic, no difference in print, metal is easier to clean, no static problem, available * Stencil thickness: Chips 0.006", SOIC 0.010" [print

Gluing Quality Issue !!!

Electronics Forum | Tue Nov 03 11:46:52 EST 2009 | davef

Search the finee SMTnet Archives for previous posts on the topic. Here's a clip from on of those posts that may get you started. [snip] * Stencil material: metal or plastic, no difference in print, metal is easier to clean, no static problem, availa

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