Electronics Forum: setting the vacuum parameters (Page 1 of 3)

Mirae Mx series, parameters to accelerate the heads in Z.

Electronics Forum | Fri Mar 30 06:59:00 EDT 2018 | bobpan

In Production Monitor....there is Utility and Axis speed. Make sure the z-axis are set to 100%. I would also check to make sure in your component information that you dont have your parts slowed down or have long place and/or pick delays. good luck

I mounted the parts on the buck-boost DCDC converter and measured the characteristics

Electronics Forum | Tue Aug 23 03:29:37 EDT 2022 | samhe

I received a buck-boost DCDC board with an optical sensor from NextPCB, so I mounted the components and measured the efficiency. Table of contents Board received from NextPCB Solder paste printing Mounting of parts Reflow operation check Attaching

Re: PCB Support Methods @ the Fuji.

Electronics Forum | Thu Sep 23 17:28:54 EDT 1999 | JohnW

| | | Question for you SMT guru's out there. | | | | | | What is the best way to support boards on Fuji's CP6 machine's x-y table...particularly for 2nd side SMT where the support side already has parts... I am toying around with the following meth

Re: PCB Support Methods @ the Fuji.

Electronics Forum | Wed Sep 22 20:57:46 EDT 1999 | JAX

| | Question for you SMT guru's out there. | | | | What is the best way to support boards on Fuji's CP6 machine's x-y table...particularly for 2nd side SMT where the support side already has parts... I am toying around with the following methods: |

Re: PCB Support Methods @ the Fuji.

Electronics Forum | Thu Sep 23 06:10:52 EDT 1999 | Wolfgang Busko

| | | Question for you SMT guru's out there. | | | | | | What is the best way to support boards on Fuji's CP6 machine's x-y table...particularly for 2nd side SMT where the support side already has parts... I am toying around with the following meth

Does pot temperature affects quality of the solder joints?

Electronics Forum | Mon Feb 06 22:38:46 EST 2017 | david_chiu

No matter in selective soldering or wave soldering process, higher pot temperature and longer wetting time can increase IMC thickness and joint strength(reliability), but as Daivf said, you need to care if the DIP component and bare PCB was damaged b

What is the rootcause for BGA Lifted PAD after reflow

Electronics Forum | Tue May 20 09:34:28 EDT 2008 | roc2x

Well something is different isn't it? * Paste * > Part supplier * Board fabrication * Was the > profile that you reference the measured > temperature or the the settings keyed into the > oven? > > The cross sections seem to show less > than exp

Re: Wave Solder Fixtures: Biting the dust FAST!

Electronics Forum | Mon Sep 14 17:39:37 EDT 1998 | Steve A

| I am running composite fixtures on my wave solder machine and after about 500 passes each (1 month)they are showing serious signs of wear in that the composite surface is bubbling up and glass fibers are also starting to show. | The problem here

Re: Wave Solder Fixtures: Biting the dust FAST!

Electronics Forum | Tue Sep 15 07:54:42 EDT 1998 | Rob Fischer

| | I am running composite fixtures on my wave solder machine and after about 500 passes each (1 month)they are showing serious signs of wear in that the composite surface is bubbling up and glass fibers are also starting to show. | | The problem h

I'm in the market for a HIGH end BGA rework machine, any recommendations?

Electronics Forum | Tue Jan 23 09:47:02 EST 2018 | dleeper

I've used VJ Electronics Summit series of rework machine. I liked the programing interface. You can used canned scripts for basic removal/replacement processes or you edit/write your own if you want a customized work flow. The machines are very ope

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