Electronics Forum: share (Page 112 of 141)

Geometric Dimensioning and Tolerancing

Electronics Forum | Sat Jun 06 09:53:59 EDT 1998 | Earl Moon

GEOMETRIC DIMENSIONING AND TOLERANCING (GDT) Using and applying GDT to printed circuitry and assemblies is very much like applying it to any other design for manufacturing (DFM) or design for assembly (DFA) requirement using concurrent engineering (C

SN100C vs. SAC 305 wave soldering

Electronics Forum | Wed Jan 11 18:44:42 EST 2006 | fctassembly

Hello Greg, Glad to hear your success with the SACX0307 copy. By the way, does the P mean it contains phosphorus? Does yours also contain bismuth like the SACX0307 (according to their plumbing solder patent for X0307)? In response to your discussion

In search of knowledge

Electronics Forum | Tue Oct 16 10:06:46 EDT 2012 | jackofallmasterofnone

Hello all, First off let me start by introducing myself. My name is Dan and I work for a contract manufacturer. During a job search I had heard from a previous co-worker that there was a packing job available at the facility where he now worked. I

Re: BS

Electronics Forum | Mon Aug 28 12:41:35 EDT 2000 | JAX

MoonMan, I'll take a crack at the list. Feel free to answer the ones I don't! 1. Solderability is a parameter which indicates how well a component can be soldered. As far as Solder Termination Coatings go, here are some up�s and down�s of a few. Ha

Re: Bridge on BGA

Electronics Forum | Fri Aug 20 17:17:14 EDT 1999 | K.T

| | | | Yesterday as I was creating a profile on a plastic BGA using Conceptronics freedom 2000 rework station, I happend to discover that I was able to remove solder bridging from a plastic BGA. | | | | | | | | This is what I did. | | | | | | | |

Re: the facts on our server

Electronics Forum | Wed Jun 16 12:43:10 EDT 1999 | Brian

Cliff, I'm sending you by e-mail (don't think I can attach a graphics file here) the doc proof that the problem lies between Atlanta and Ft Lauderdale. This was an attempt to trace your routing. From Cyprus, it crossed the Atlantic by West Orange. U

Vapor phase versus forced convection

Electronics Forum | Mon Aug 16 20:19:10 EDT 2004 | Grant

Hi, We have both Vapor Phase ASSCON semi auto as well as Soltec convection inline ovens. I must say we had no end of problems with Vapor Phase. We tried everything, and just could not totally eliminate tomb-stoning completely. We would always get a

Researching placement machines - where do I start?!

Electronics Forum | Wed Nov 04 11:35:01 EST 2009 | dilogic

1. can you load cut tape onto the feeders, or only reels? You can, but you have to use cover tape extender (pretty cheap, though) >2. how about parts on trays (like Atmel AVRs in the QFP package)? You need tray feeder. But you can "make" your own

Main Points And checklist Of PCB Design

Electronics Forum | Wed Nov 13 04:12:20 EST 2013 | hqew2013

Do you design or define PCB layouts? If so circuit board, what rules and checks do you have in place to make sure your results are... optimal? Over the years, I've created a PCB design checklist to keep me out of trouble. I share these nuggets with m

Re: BGA problem: open after reflow

Electronics Forum | Fri Jan 19 17:43:30 EST 2001 | davef

Intermetalic Layer (IL). A compound formed at the interface of two different metals, whose atoms have an extremely high natural attraction for each other, so high, that they do not bond to other elements by any other means. Also, intermetalic compo


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