Electronics Forum | Tue Aug 21 20:52:06 EDT 2007 | davef
There is not standard for the force to pull an axial lead from a soldered connection. ".....IPC does not have pull tests in any of its standards, and some reliability experts would prefer to keep it that way, pull tests are commonly used by some lea
Electronics Forum | Wed Jun 12 08:13:29 EDT 2002 | davef
Don't sound proper. There is no specification. Pad peel strength test methods are: * IPC-TM-650, Method 2.4.21 for multiple solderings * IPC-TM-650, Method 2.4.8 for copper peel with a Instron machine. Typical requirement for Cu is: 6 lbf/in [1
Electronics Forum | Tue Jun 11 22:06:06 EDT 2002 | scottxiao
I encounter the problem, it is easy for pad(copper) to drop off from the PCB, which is Ni/Au finish. so my question is whether there is any specification about the force between pad and laminate material, and does the PCB corpoartion test this parame
Electronics Forum | Thu Feb 18 20:24:37 EST 1999 | Tony
I'm trying to replace the PTH connectors with the SMT connectors in my design, and would like to make sure the SMT connector solder joints are as stong as PTH's. What's the right test to verify that? Is Pull and Shear test is the right choice? Where
Electronics Forum | Fri Apr 29 11:21:35 EDT 2005 | jsloot
I have heard the term as both green stick and orange stick, but yes, pushing on the leads to detect un soldered leads. The amount of force is subjective. Any thoughts on this is appreciated.
Electronics Forum | Mon Oct 25 21:49:14 EDT 2004 | davef
First, any results of pull or shear tests are unscientific at best. [We pop our BGA from boards with, appropriately enough, a beverage can opener.] Second, we have no have problems with your ENIG specification. Third, as with your customer, we'd e
Electronics Forum | Fri Apr 29 09:08:45 EDT 2005 | davef
We call this the "orange stick test", but who's coloring? In preforming the test, you're supposed to use a light touch. Unfortunately, it's difficult to calibrate a "light touch." So, operators often end-up using too much force when probing or usi
Electronics Forum | Mon Jul 02 20:13:41 EDT 2001 | davef
We agree with Wolfgang. Adding points along his line of reasoning: * Also consider placed component prescience. Sometimes, a mis-pick results in paste on the nozzle, which leads to the next component being stuck on the nozzle and not placed, which
Electronics Forum | Mon Jul 02 04:06:07 EDT 2001 | chinaren
Hello: Did anyone make some tests to show the adherence force between placed components and solder paste before soldering? and is there anyone who measure this adherence force during production?and any benifits fromthis activity? Thanks with best re
Electronics Forum | Mon Jul 02 09:28:24 EDT 2001 | blnorman
You can test for solder paste tack using IPC-TM-650 method 2.4.44. This will give you an idea of the adhesive strength of your paste prior to reflow.
