Electronics Forum | Tue Jul 03 08:14:49 EDT 2001 | Stefan Witte
If you hold your board sideways in a 90 degree angle you apply a force of 1 g to your components. 1 g translates into 32 ft / sec. square. This is not too much acceleration for fearless roller coaster drivers but Melf�s and Tantalums can fall off at
Electronics Forum | Fri May 17 16:37:28 EDT 2002 | Tom Druan
I was wondering if anyone could direct me towards documentation on shear test methods/apparatus to test the bond integrity of a solder ball to its substrate. Thanks.
Electronics Forum | Fri May 17 16:53:50 EDT 2002 | davef
I recall a couple of papers in the SMTA 'Knowledgebase' that used ball shearing and an element in a study that compared BGA [maybe uBGA] component fabrication methods, er sumpin.
Electronics Forum | Thu Nov 14 09:02:46 EST 2002 | MA/NY DDave
Hi Making contact has been one reported problem, so some testers put in higher force probes that then might cause problems. If fixturing is done correctly, the OSP is done correctly, and test follows close in time after soldering little problems s
Electronics Forum | Thu Nov 14 09:24:07 EST 2002 | joconnell
What about when debugging the board I recently saw a case where we damaged a board between - 5-10 cycles of the fixture It's a catch 22 - where you need high force probes to breal the OSP - but the copper is hard surface, not like the solder HASL a
Electronics Forum | Wed Dec 10 11:11:04 EST 1997 | Rich Scheleski
Is there a spec for the adhesives used to hold down parts before wave soldering. What size dots are recommended and what is the maximum shear force(1LB?) tested for to ensure good adhesion. Your help is appreciated Rich Scheleski
Electronics Forum | Tue Oct 15 09:52:38 EDT 2019 | SMTA-Davandran
I seeing connector with butt (I) lead drop off after drop test conducted. the current shear force is about 3kgf. How can this problem improved.
Electronics Forum | Sun Jan 11 12:03:51 EST 1998 | Bob Willis
As a basic guide the minimum spec you should look for is 500g you should achieve a force on most chip parts of 800-1000g. Parts are lost on wave soldering due to no material, poor curing, poor surface adhesion and poor handling. Its not the wave sold
Electronics Forum | Wed Oct 27 16:55:38 EDT 1999 | Joe Herz
Jerry, In our house we generally run a glue bottom last but people do it both ways. Our logic revolves around protecting components from being knocked off the board during handling and processing prior to wave solder (this is most important with sm
Electronics Forum | Fri Oct 05 16:05:58 EDT 2001 | seand
Hello everyone, Your chief variable here is going to be your epoxy. Different materials react accordingly to various inspection methods but, DEPENDING on your print parameters and material, you may be able to utilize an inline inspection machine.
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