Electronics Forum | Tue Oct 26 11:22:45 EDT 1999 | Morris
I am evaluating a bottom side glueing process. I was wondering if anyone could share their shear force specifications, or how they were developed. I would be most interested in the 0805 and Sot23 package types. Also, does anyone know if heating th
Electronics Forum | Tue Oct 26 11:15:55 EDT 1999 | Morris
I am evaluating a bottom side glueing process. I was wondering if anyone could share their shear force specifications, or how they were developed. I would be most interested in the 0805 and Sot23 package types. Also, does anyone know if heating the
Electronics Forum | Sat Jun 23 11:41:34 EDT 2007 | grantp
Hi, We use 1:1 for 1 mm BGA and it works fine. We used it at 4 thou laser cut stencils when we had a manual stencil printer, but have moved to 5 thou with the DEK and it works ok. We originally went to 4 thou because of paste release, but the DEK
Electronics Forum | Mon Dec 17 07:34:07 EST 2001 | Adam
Dear Colleagues Does anyone know or care to share any information as to typical torque values ( N/cm ) for components that have been placed using screen printing surface mount adhesive, using a plastic stencil ? Are there any industry set shear test
Electronics Forum | Wed Oct 05 15:03:40 EDT 2005 | Amol
depends on what you want evaluated! you can thermal cycle the BGAs and the examine the x-sections to determine failure modes at different stages of thermal cycles. you can do a stress test and corelate the # of thermal cycles with the microstructu
Electronics Forum | Thu Nov 05 16:56:38 EST 2009 | lynn_norman
In a previous job, we had torque off requirements for different sized components for our screen print adhesive (non-conductive in our case). We used a torque watch that would measure max torque, so we could test production boards, shear testing was
Electronics Forum | Thu Dec 09 15:19:21 EST 2004 | nrocco
Can anyone point me in the direction to find some IPC standards for lead free solder joint reliablity tests, such as shear tests, pull tests, vibe tests, enviroment tests, etc. I need to know what the specs. are on all aspects of reliability and how
Electronics Forum | Thu May 13 16:59:08 EDT 1999 | KT
Looking for a reasonably priced portable device to do strength test(shear/twist)on glue cured Cap/Res. Any suggestions? Thanks
Electronics Forum | Thu Nov 05 03:40:34 EST 2009 | valeo
Hi Rajeshmara, Mail sent with the datasheet of the glue we use in production. Thanks for first information you provide me for the shear specifications on 1206. But can you be more precise on this point ? How did you define it ? Is anyone have more
Electronics Forum | Thu Jul 09 21:04:50 EDT 1998 | Dave F
| Hi there, | I am looking for some informations concerning the shear or pull strength of a typical TQFP 20 mils leads in relationship with the Copper/Tin intermetalic layer thickness. Could anyone help? | | Thank in advandce. | rgs, | chiakl Chiakl
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