Electronics Forum: shearing force test (Page 9 of 31)

Re: SMT components Fall Off

Electronics Forum | Mon Jun 14 15:50:07 EDT 1999 | JohnW

| I am looking for more information about: | | 1) What kind of evaluation can I do to measure the resistance to fall off of a bottom side glueded SMT component?; | | 2) There is some influence of doble wave solder machine (temperature, flux, etc) i

Force sensor error on MyData My12

Electronics Forum | Sun Dec 17 13:52:59 EST 2023 | tomdegas

How can I bypass the " Hydra force sensor can't calibrate" during the "Hardware Initialization" test. This is stopping me from starting the machine.

Solder joint strength

Electronics Forum | Wed Oct 06 03:18:01 EDT 2004 | Joseph

Dear all, Recently our customer complaint that some components being came off from the pcba after dropping test.But the curious is, the leads show visible solder fillet covering more than 75% of termination area on pad, which is acceptable as per IP

BGA Device with Slanted and Damaged Spheres

Electronics Forum | Wed Dec 15 19:31:26 EST 2004 | Thomas Denison

We have a ceramic BGA that the component supplier has misaligned the spheres in the fixture so they slant .007" out of alignment from the substrate pads. When the devices are tested at the component manufacturer this alignment issue also causes the

Grid Lok

Electronics Forum | Tue Jul 31 15:29:45 EDT 2001 | hinerman

Research was done into the deflection of a totally unsupported (topside) PCB of 0.050" thickness. A dial indicator was placed on the surface and the tooling was set. The deflection ranged from 0.005" to 0.007". This is minor when you consider th

glue measurement

Electronics Forum | Tue Oct 09 20:40:48 EDT 2001 | davef

No one suggested that you speak for other suppliers and nor would they want� you �to speak for them." You shouldn�t make this something that it isn�t. All that was requested courteously was suggestions of alternate suppliers that could be considere

Re: Aperture size for Micro BGA stencil

Electronics Forum | Thu Jun 22 12:50:13 EDT 2000 | JAX

Igmar, Although I agree with Chrys that square is good,( Better volumn ) his explanation is not entirely correct. Heres a little insert from automata: With square apertures, solder paste is deposited at the center of the aperture. The center release

Fine Pitch Pad Width Size VS Component Lead Width

Electronics Forum | Wed Apr 11 06:06:53 EDT 2001 | wbu

Hi Dreamsniper, the IPC land design standard is IMO a good reference. If you use the online calculator you can influence the result by varying for example manufactoring parameters. For the same lead width and same tolerances (and of course pitch) we

Problems with devices utilizing a

Electronics Forum | Tue Mar 13 08:04:28 EDT 2007 | Cmiller

We have used thousands of them with no problems. They will not aid in "connector retention" unless you have a shear force at exactly the right angle. This is an advertising joke. They will help with alignment of the connector. Open your holes up so t

Conformal over No-Clean

Electronics Forum | Fri Apr 26 09:32:22 EDT 2002 | blnorman

We conformally coat over NC solder paste. No problems. We're using a platinum catalyzed addition cure silicone. The only concern with this conformal coating is cure inhibition. You must test the coating over the residues to be sure there is no in


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