Electronics Forum | Wed Mar 30 16:07:24 EST 2005 | Dreamsniper
If there's no shear strength standard for solder joint, how will I define my pad width and length then. I have a 8.5 mils width and my component lead width is 8.66 mils based on manufacturer's minimum width specification. How will I identify that it
Electronics Forum | Thu Nov 13 11:45:04 EST 2008 | pbarton
We have seen a similar problem. Turned out to be mechanical stress on the component caused by the method of location and clamping at ICT. Where is the component located on the assembly? Poorly adjusted clamping pillars on clamshell fixtures can cause
Electronics Forum | Thu Aug 30 21:57:26 EDT 2001 | Franky
I have problem about glue printing measurement ,anybody has process of glue printing . How do you measure? as I know "push test" is the method for testing the strength of connection of component and board but I don't have specification of testing for
Electronics Forum | Mon Oct 08 20:58:35 EDT 2001 | ericchua
Look like no way you can measure after glue printing. We have been running glue printing for about 2 years and using the "push test" method for testing the strength of connection of component and board. I don't see any problem. For component ( 0603 &
Electronics Forum | Fri Mar 29 07:53:12 EDT 2019 | davef
Why are you printing paste on test via? In the old days, we probed soldered pads to cushion impact force of probing. Is that still a reasonable practice?
Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef
Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c
Electronics Forum | Tue Nov 03 20:00:47 EST 2009 | davef
Solder Mask Adhesion Pull Test Tape List IPC-TM-650 Test Method 2.4.28.1, Adhesion, Solder Resist (Mask), Tape Test Method, defines the procedure for determining the adhesion of solder resists (masks) used over melting metals, (such as solder plated
Electronics Forum | Wed Aug 15 16:08:02 EDT 2001 | davef
A properly formed solder connection is stronger than the underlying copper to laminate bond. Measuring pad peal strength: IPC-TM-650, Method 2.4.21 for multiple solderings, use Method 2.4.8 for copper peal using an Instron machine. Typical requiremen
Electronics Forum | Sun Jun 25 08:51:02 EDT 2006 | cloggy
Problems like these are not caused by bad feeder quality. As described in the solution finding, the pull off forces of the cover tape are just too high. Cause is the blistertape and not the a feeder. Have you ever tested if the pull of force of the
Electronics Forum | Mon May 09 19:27:19 EDT 2022 | mikevb
Thanks for the response. Yes, the z motor initializes in the service program just fine. It moves and reads a position. Also in the service program, I try to test the z force sensor and it gives me the same error - no z indicator at all. All cables ar
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